相控阵雷达T/R模块封装复合材料现状及发展趋势

程东锋; 胡晓宇; 周达; 邱得超; 樊思燕; 何鹏; 牛济泰

相控阵雷达T/R模块封装复合材料现状及发展趋势

程东锋^{1, 2},
胡晓宇¹,
周达¹,
邱得超¹,
樊思燕¹,
何鹏³,
牛济泰^{1, 2, 3,}

1.
河南理工大学　材料科学与工程学院, 焦作 454003
2.
河南省结构功能性金属基复合材料工程技术研究中心, 焦作 454003
3.
哈尔滨工业大学先进焊接与连接国家重点实验室, 哈尔滨 150001

基金项目: 国家自然科学基金(51245008)；河南省科技攻关项目 (222102220006)；河南省高等学校重点科研项目计划 (22B430016)；河南理工大学博士基金 (B2019-38)

详细信息

通讯作者:
牛济泰，俄罗斯自然科学院外籍院士，教授，博士生导师，研究方向为新型材料焊接性及焊接新工艺研究　E-mail:niujitai163@com

中图分类号: TB331
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- 被引次数: 0
出版历程
- 收稿日期: 2022-10-20
- 修回日期: 2022-12-05
- 录用日期: 2023-01-03
- 网络出版日期: 2023-02-02
- 刊出日期: 2023-08-15

Research status and development trend of composite materials for phased array radar T/R module packaging

CHENG Dongfeng^{1, 2},
HU Xiaoyu¹,
ZHOU Da¹,
QIU Dechao¹,
FAN Siyan¹,
HE Peng³,
Niu Jitai^{1, 2, 3
,}

1.
School of Materials Science and Engineering, Henan Polytechnic University, Jiaozuo 454000, China
2.
Henan Province Structural Functional Metal Matrix Composite Engineering Technology Research Center, Jiaozuo 454000, China
3.
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

Funds: National Natural Science Foundation of China (51245008)；Science and Technology Project of Henan Province (222102220006) Key Project of Science and Technology Research of Henan Provincial Department of Education (22B430016) Ph.D Foundation Program of Henan Polytechnic University (B2019-38)

摘要

摘要: 目的随着航空航天、军工、电子技术的迅猛发展，封装方式与封装材料已成为电子设备进一步实现小型化、轻量化和高性能的重要制约。以铝为基体的轻质材料—碳化硅颗粒增强铝基复合材料和高硅铝合金逐渐成为相控阵雷达T/R模块的第三代封装材料，而二者的制备和加工技术存在的问题成为限制第三代材料全面推广和应用的重要瓶颈。通过对铝基复合材料和高硅铝合金的加工和应用研究技术现状进行综述分析，找出两种材料的问题并进行展望，为两种材料的进一步推广提供参考与指导。方法本文根据相控阵雷达T/R模块封装盒体在制造过程中的四个步骤出发，复合材料的制备、采用机械加工手段将复合材料加工成所需要的形状、尺寸，对盒体进行表面金属化(镀镍镀金)，提高壳体可焊性并保护元器件不受污染，最终进行盒体封装。依次介绍了铝基复合材料和高硅铝合金的制备方法，搅拌铸造法、液态金属浸渗法、粉末冶金法、喷射沉积法，分析了两种材料不同制备方法的优缺点；机械加工性能：车削、铣削、钻销等传统加工方法和电火花等非传统机加工方法，焊接工艺，熔化焊、固相焊、钎焊，及表面处理等加工和应用研究技术现状。结论得出两种材料都表现出优异的综合性能，但也都在材料制备、机械加工和焊接成形等方面存在一些难点，且各有优、劣势，主要表现在以下几个方面：①作为增强相的SiC和Si都来源较为丰富，制备工艺比较成熟，成本低廉，对环境没有污染，对人体没有伤害；②用SiC和Si作为增强相制备铝基复合材料，在调整体积分数的基础上，都具有密度低、热导率高、热膨胀系数低，比强度和刚度较高等优点，且热膨胀系数都可以满足电子封装的要求，且随着SiC和Si的体积分数增加，以两者为增强相的复合材料导电、导热性能都下降；③两种复合材料都有机加工难度，但是侧重点略有不同：SiC/Al复合材料是硬度大，刀具磨损严重，难以长期高质量保证精度；Si/Al复合材料机加工稳定性相对较好，但高Si/Al中由于初晶硅的存在，容易发生局部脆断。④在SiC/Al和Si/Al复合材料的制备和连接过程中，增强相的均匀分布和体积分数的精准控制是共有问题，但也存在不同难点：SiC/Al复合材料主要在于SiC-Al界面控制有较大难度，而Si/Al复合材料中初晶硅相尖角处应力集中，材料力学性能较差，如何改善初晶硅相的形态和分布则是急待解决的问题。其他：展望：(1)结合现有的制备方法，将多种工艺进行交叉融合，探索出更加高效简单、生产成本较低的新技术；(2)在对现有增强体的复合材料的制备与加工研究基础上，探索更新的增强体材料，例如石墨烯或纳米尺度的SiC颗粒等，以制备更加优异性能的复合材料；(3)在冷加工领域，完善机械加工手段，尤其是面对强度、塑性不均匀的复合材料新刀具的研制与开发，探索合理的工艺参数，获得理想的加工表面质量；(4)在焊接领域，面对基体材料与增强相在物理化学性质上的巨大差异，进一步探讨更为有效的固相焊接方法与选择更为优异的焊接材料将成为连接技术的主要研究趋势和创新方向。同时，进一步优化母材质量，特别是增强相的均匀分布和尺寸控制，以及母材被焊表面的预处理技术，都是提高复合材料接头质量必须考虑的重要因素。
- T/R模块 /
- 电子封装 /
- SiC颗粒增强 /
- 铝基复合材料 /
- 高硅铝 /
- 制备加工
Abstract: With the rapid development of aerospace, military, and electronic technologies, packaging methods and packaging materials have become important constraints for electronic devices to further achieve miniaturization, lightweight, and high performance. Phased array radar T/R module packaging materials have experienced from the first generation of Kovar alloy to the second generation of copper-tungsten alloy, and the emergence of the third generation of lightweight materials with aluminum as the matrix in recent years - silicon carbide particle reinforced aluminum matrix composite material and high silicon aluminum alloy, and the problems in the preparation and processing technology of the two have become an important bottleneck restricting the comprehensive promotion and application of the third generation of materials. In this paper, the preparation methods, machining properties, welding processes, and surface treatment of the new generation of packaging materials are reviewed, and the research technology status of the processing and application of the new generation of phased array radar T/R module packaging composites is introduced in detail, and its development trend prospects.
- T/R module /
- Electronic Packaging /
- SiC particle reinforced /
- Al matrix composites /
- High Silicon Aluminum /
- Preparation and processing

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图 1 电子封装盒体

Figure 1. Electronic packaging box

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图 2 CE11合金制备的密封航空电子产品^［11］

Figure 2. Hermetic aerospace electronic product manufactured with 50 vol%Sip/Al alloy

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图 3 SiCp/Al 复合材料制备的封装外壳^[9]

Figure 3. Packaging shell prepared with SiCp/Al Compos

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图 4 相控阵雷达T/R模块封装盒体制备流程图：

(a)颗粒增强铝基复合材料的几种典型的制备方法^[12](b)CE13 合金制备的雷达用封装外壳^[11](c)镀金后铝基复合材料盒体^[13](d)激光封焊铝基复合材料盒体^[13]

Figure 4. Flow Chart of Phased Array Radar T/R Module Packaging Box Preparation:

a) Several representative fabrication routes for Particle reinforced aluminum matrix composites (b) Packaging shell for radar application prepared with CE13 alloy (c) Aluminum Matrix Composite Box after Gold Plating (d) Laser Sealing Aluminum Matrix Composite Box

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图 5 原始参数和优化后参数制备的SiC/Al复合材料心部的组织形貌^[13]

Figure 5. Microstructure of the core of SiC/Al composite prepared with original parameters and optimized parameters

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图 6 SiCp/Al复合材料的制备工艺路线图^[10]

Figure 6. Preparation Process Route of SiCp/Al Composite

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图 7 SiCp/Al复合材料的机械加工方法^[29]

Figure 7. Machining Methods of SiCp/Al Composites

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图 8 复合材料加工微观形貌图^[42]

Figure 8. Micromorphology images of composite material processing

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图 9 传统车削和振动辅助车削中的刀具侧面磨损模式的显微照片^[49]

Figure 9. Micrograph of the tool flank wear patterns in (a) conventional turning and (b) vibration-assisted turning.

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图 10 焊缝横剖面的焊接气孔典型形貌

Figure 10. Typical morphology of pores within cross section of weld

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图 11 Cu箔中间层TLP焊接复合材料SiCp/ZL101和 SiCp/Al焊接接头与母材的剪切强度^[71]

Figure 11. Shear strengths of welded joints of SiCp/ZL101 and SiCp/Al using Cu foil layer by TLP bonding

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图 12 3种不同钎料钎焊接头的剪切强度对比

Figure 12. Comparison of shear strength of brazed joints with three different solders

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表 1 常用封装材料及其性能指标

Table 1. Performance parameters of common packaging materials

Performance parameters	Materials
	Semiconductor materials		1 st generation packaging materials			2 nd generation packaging materials		3 rd generation packaging materials
	Si	GaAs	Kover	Invar	W	W/Cu	Mo/Cu	SiC/Al	Si/Al
CTE/( 10⁻⁶℃⁻¹)	4.1	6.0	5.9	0.4	4.4	7.6 ~ 9.1	7.2 ~ 8.0	7 ~ 17	7~ 17
TC/(W/(m·K))	135	39	17	11	174	180 ~ 210	160 ~ 190	145 ~ 215	140 ~ 220
Density/ (g·(cm⁻³))	2.3	5.3	8.3	8.1	19.3	15.6	9.9	2.7 ~ 2.9	2.4 ~ 2.6

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表 2 铝基复合材料的常用制备方法及优缺点^[14]

Table 2. Advantages and disadvantages of Common preparation methods of aluminum matrix composites

制备方法	优点	缺点
搅拌铸造法	工艺简单，制备成本低，适合大规模化生产	增强体的体积分数有限，分布不易均匀化
液态金属浸渗法	可制备高体积分数增强体复合材料；增强相和基体之间的润湿性好、产品气孔、疏松等缺陷少；同时还可制备形状较为复杂的零部件	预制体容易变形，设备较为复杂，生产成本相对较高
粉末冶金法	增强相分布均匀，界面反应易于控制、工艺参数可选择	设备成本高，工艺复杂，制备周期长，零件的结构、形状和尺寸都受到一定的限制
喷射沉积法	界面反应易于控制，基体金属的晶粒细小且均匀，无宏观偏析，且增强相的体积分数以及粒度也不受限制	原料浪费严重，成本很高
原位生成法	增强体表面无污染，与基体相容性好，结合强度高	增强相的形成、均匀化分布及有害反应难以有效控制

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