Advances in interfacial modulation and thermal conductivity of diamond/Al composite heat dissipation materials
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摘要: 金刚石/Al复合材料兼具低密度、高热导率和热膨胀系数可调等优点，近年来成为新一代热管理材料的研究热点之一。但是，复合材料制备过程中金刚石和Al界面产物Al4C3会严重影响复合材料的性能，增大金刚石-Al界面热阻，并且其易水解的特性容易在使用过程中造成复合材料失效。本文从界面Al4C3相的负面作用入手，详细介绍了目前抑制界面Al4C3相的主要方法(包括界面调控、金刚石表面化学改性、金刚石表面改性涂层和基体合金化等)对复合材料界面和热导率的影响，最后对未来金刚石/Al复合散热材料的发展方向进行了展望。Abstract: Diamond /Al composites have the advantages of low density, high thermal conductivity and adjustable thermal expansion coefficient, and thus become one of the research hotspots of thermal management materials in recent years. However, Al4C3, the interface product between diamond and Al, will seriously affect the properties of the composites, increase the thermal resistance at the diamond-Al interface, and its easy hydrolysis will easily lead to the failure of the composites in service. In this paper, starting with the negative effects of interface Al4C3 phase, the effects of the current main methods to inhibit interfacial Al4C3 phase (including interfacial control, diamond surface chemical modification, diamond surface modified coating and matrix alloying, etc.) on the interface and thermal conductivity of composites are described in detail. Finally, the development direction of diamond/Al composite heat dissipation materials in future is prospected.
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图 1 金刚石/Al复合材料热导率改善方式
Figure 1. Diamond/aluminum composite thermal conductivity improvement approach
图 2 金刚石 {100}/Al界面的透射电镜显微照片。(a)界面区域的低放大倍率，(b)金刚石的会聚光束图案，Z=[011]，(c)金刚石-Al4C3界面的HRTEM图像，(d)金刚石和Al4C3的SAD图案，(e)对(d)的解释[15]
Figure 2. Transmission electron microscope micrographs of the diamond {100}/Al interface. (a) Low magnification of the interfacial region, (b) convergent beam pattern of diamond, Z=[011], (c) HRTEM image of the diamond-Al4C3 interface, (d) SAD pattern of diamond and Al4C3, (e) interpretation of (d) [15]
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