Research on hot sizing mechanism and simulation model of composite cylindrical grid structures
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摘要: 复合材料回转体网格结构呈现多特征复杂结构属性,工艺固化变形限制了结构的制造装配精度。基于双马树脂的粘弹性,开展航天802双马树脂高温蠕变拉伸测试,证实双马树脂蠕变卸载后存在不可恢复的粘性流动应变,揭示了可以通过热矫形减少大型复合材料网格结构工艺变形的微观组分材料机理。推导建立复合材料网格结构的应变能增量理论,模拟复合材料网格结构热矫形荷载施加、松弛以及回弹过程,确定网格结构矫形回弹轮廓,与实验结果对比验证应变能理论模型有效性。分析复合材料网格结构热矫形内应力失效、矫形点个数、基于时温等效的工艺条件等影响因素,形成了复合材料网格舱段结构热矫形变形控制工艺变形仿真方法。Abstract: The composite cylindrical grid structures exhibit quite a few features and complex structural characteristics, and its precision in manufacturing is restricted due to the curing deformation. Based on the viscoelasticity of the bismaleimide resin, high temperature creep tensile testing of the aerospace 802 bismaleimide resin was performed, confirming the existence of unrecoverable viscous flow strain after the unloading of the bismaleimide resin creep. The micro component material mechanism was revealed to reduce the process curing deformation of large composite grid structures through hot sizing. The deformation energy increment theory for composite grid structures was derived and established. The process of hot sizing load application, relaxation, and rebound of composite grid structures was simulated. The correction rebound profile of grid structures was determined, comparing with experimental results to verify the effectiveness of the deformation energy increment theory. The failure of internal stress, number of correction points and process conditions based on time temperature equivalence of hot sizing composite grid structure was analyzed. A complete process for the deformation simulation method of hot sizing deformation control for composite grid structures formed.
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Key words:
- composite /
- grid structure /
- high temperature creep /
- hot sizing /
- finite element analysis
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图 1 树脂基复合材料结构热矫形机理
Figure 1. Mechanism of hot sizing of polymer matrix composite structures
U—Displacement imposed by the correction; T—Temperature imposed by the correction; $ {{ \varepsilon }}_{\text{1}} $—General elastic deformation; $ {{ \varepsilon }}_{\text{2}} $—High elastic deformation; $ {{ \varepsilon }}_{\text{3}} $—Viscous flow deformation; E—Modulus of elasticity; $ \eta $—Coefficient of viscous flow
图 2 复合材料网格结构热矫形全过程轮廓变化
Figure 2. Profile changes throughout the entire process of hot sizing of composite gird structures
$ {\overset{\lower0.5em\hbox{$\smash{\scriptscriptstyle\rightharpoonup}$}} {u } _1} $—Field of change of applied corrective displacement; $ {\overset{\lower0.5em\hbox{$\smash{\scriptscriptstyle\rightharpoonup}$}} {u } _2} $—Field of displacement change when deformation rebound occurs in the interstage segment; $ {\overset{\lower0.5em\hbox{$\smash{\scriptscriptstyle\rightharpoonup}$}} {u } _3} $—Difference between the residual deformation and the initial deformation displacement field after the cabin segment has undergone creep
图 6 圆度定义(a)、TG800/802双马树脂复合材料网格舱段结构(b)、TG800/802双马树脂复合材料网格舱段固化变形预报结果((c)、(d))
Figure 6. Definition of roundness (a), TG800/802 bismaleimide resin composite grid interstage segment (b), predicted results of curing deformation of TG800/802 bismaleimide resin composite grid interstage segment ((c), (d))
表 1 TG800/802双马树脂复合材料室温力学性能
Table 1. TG800/802 bismaleimide resin composite properties at room temperature
E11/MPa E22/MPa G12/MPa G23/MPa $ {\mu }_{\text{12}} $ $ {\sigma }_{\text{11}}\text{/MPa} $ $ {\sigma}_{\text{22}}\text{/MPa} $ ILSS/MPa $ {\sigma}_{\text{12}}\text{/MPa} $ 164000 9310 5690 3280 0.38 2482 59 101 88 Notes: E—Modulus of elasticity; G—Modulus of shear; μ—Poisson’s ratio; σ—Intensity of stress; ILSS—Interlaminar shear strength. 表 2 TG800/802复合材料平板及舱段结构铺层
Table 2. Plying of TG800/802 composite laminate and grid interstage segment
Composite Ply Skin [45/−45/0/90/0/0/90/0/−45/45] End frame [45/−45/0/90/0/0/90/0/−45/45]3 Thickened zone [45/0/−45/0/15/0/−15/0/15/90]6 表 3 网格舱段层合板单元失效指数
Table 3. Failure index of grid interstage segment laminate unit
Failure mode Hashin Fiber tensile failure 0.008 Fiber compression failure 0.000 Matrix tension failure 0.889 Matrix compression failure 0.157 表 4 树脂模量等效衰减程度对应残留应力水平
Table 4. Equivalent attenuation degree of resin modulus corresponding to residual stress
Decay of
resin
modulusInternal stress/MPa Maximum
principal stressS22 S12 S13 5% 194.7 17.1 6.9 19.6 6% 227.4 19.8 8.1 22.9 9% 410.8 33.2 18.6 40.5 -
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