复合氧化物纳米粉掺杂BaTiO3 基MLCC 超细瓷料

李波, 张树人, 周晓华, 王升, 唐斌

李波, 张树人, 周晓华, 等. 复合氧化物纳米粉掺杂BaTiO3 基MLCC 超细瓷料[J]. 复合材料学报, 2005, 22(4): 91-95.
引用本文: 李波, 张树人, 周晓华, 等. 复合氧化物纳米粉掺杂BaTiO3 基MLCC 超细瓷料[J]. 复合材料学报, 2005, 22(4): 91-95.
LI Bo, ZHANG Shuren, ZHOU Xiaohua, et al. NANOCOMPOSITE DOPED BaTiO3-BASED ULTRAFINE DIELECTRICSFOR MULTILAYER CERAMIC CAPACITANCE[J]. Acta Materiae Compositae Sinica, 2005, 22(4): 91-95.
Citation: LI Bo, ZHANG Shuren, ZHOU Xiaohua, et al. NANOCOMPOSITE DOPED BaTiO3-BASED ULTRAFINE DIELECTRICSFOR MULTILAYER CERAMIC CAPACITANCE[J]. Acta Materiae Compositae Sinica, 2005, 22(4): 91-95.

复合氧化物纳米粉掺杂BaTiO3 基MLCC 超细瓷料

详细信息
    通讯作者:

    张树人,教授,博士生导师,研究方向为电子信息材料与元器件 E-mail:zsr@uestc.edu.cn

  • 中图分类号: TB332

NANOCOMPOSITE DOPED BaTiO3-BASED ULTRAFINE DIELECTRICSFOR MULTILAYER CERAMIC CAPACITANCE

  • 摘要: 采用新颖的纳米掺杂工艺成功制备了BaTiO3 基MLCC 超细抗还原瓷料。TG-DTA、XRD、TEM 分析表明, 通过水基溶胶-凝胶法合成了高分散、高活性的纳米掺杂剂, 平均粒度约40.2 nm。根据传统工艺与纳米掺杂工艺的比较, 对纳米掺杂机理进行了研究。实验发现, 由于纳米粉体的特殊效应, 纳米掺杂工艺能更有效地提高掺杂原子的取代改性作用, 从而更显著地改善瓷料的微观结构和宏观介电性能。样品经测试符合EIAX7R/ X8R 标准, 其介电常数K25 ℃ > 2800 、介质损耗tanδ< 110 %、绝缘电阻率I R = 10.2 Ω ·cm、平均晶粒尺寸Gav≈0.3μm。
    Abstract: A novel nano-doping process was int roduced for the preparation of Ba TiO3-based ult rafine nonreducibledielect rics for multilayer ceramic capacitance (MLCC) . According to TG-DTA , XRD and TEM analysis , the nano-dopant prepared by the water-based sol-gel method was well dispersive and active. The nano-doping mechanism wasinvestigated based on comparing conventional process with nano-doping process. It indicated that due to the specialnano-effect , the modification effect of foreign atom was improved effectively and the microst ructure and macro dielect ric characteristics of so acquired ceramics were improved consequently. The result s show that high performancedielect rics are obtained , with permittivity more than 2800 , dielect ric loss lower than 110 % and average grain size about 0.3μm , which satisfies the requirement s of EIA X7R/ X8R specifications.
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出版历程
  • 收稿日期:  2004-09-06
  • 修回日期:  2004-11-08
  • 刊出日期:  2005-08-14

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