高体积分数SiC<sub>P</sub>/ Al 复合材料电子封装盒体的制备

高体积分数SiC_P/ Al 复合材料电子封装盒体的制备

基金项目: 国家自然科学基金项目(50274014) ; 民口配套研制项目(28300007)

详细信息

School of Materials Science and Technology| University of Science and Technology Beijing| Beijing 100083| China

摘要

摘要: 采用注射成型方法制备了SiC_P封装盒体的预成型坯, 用压力浸渗方法将熔融铝浸渗到SiC_P封装盒体的预成型坯中, 制备出含SiC_P体积分数为65 %的SiC_P / Al 复合材料的封装盒体。SEM 观察表明, 经过压力浸渗后SiC_P / Al 复合材料组织均匀且致密化高, 室温热膨胀系数为8. 0 ×10^-6 / K, 热导率接近130 W/ (m·K) , 密度为2198 g/ cm³ , 能够很好地满足电子封装的要求。
- SiC_P / Al 复合材料 /
- 脱脂 /
- 注射成型 /
- 压力熔渗
Abstract: The SiC_P preformed compact was prepared by Powder Injection Molding ( PIM) , and the melting aluminum penet rated into the SiC_P preformed compact by the pressure infilt ration method to manufacture the elect ronicpackage box of SiC_P (65 %) / Al composites. SiC_P (65 %) / Al composite manufactured by pressure infilt ration has highdensity and homogeneous microst ructure. The density of the composite is 2. 98 g/ cm³ ; the thermal expansion coefficient and thermal conductivity of the composite are 8. 0 ×10^-6 / K and nearly 130 W/ (m·K) at room temperature ,respectively , which is up to the request of the elect ronic package.
- SiC_P / Al composites /
- debind /
- PIM /
- pressure infilt ration