Abstract: With the increasing integration density and power density of electronic products. It is particularly important to optimize the research of thermal interface materials. In this paper, one-dimensional silicon carbide whisker (SiC_w) was used as filler and silicone rubber was used as matrix to prepare thermal conductive silicone rubber composites. The microstructure, phase structure, thermal conductivity and insulation of the composites were comprehensively analyzed. Firstly, the modified material of SiC_w coated by Fe₃O₄ was prepared by coprecipitation method. Secondly, SiC_w coated with Fe₃O₄ was evenly dispersed in the liquid silicone rubber matrix. Finally, it is placed in a constant magnetic field to complete whisker orientation and matrix curing. The results show that the surface of SiC_w whiskers is coated with Fe₃O₄ nanoparticles, and they are oriented in the silicone rubber matrix. Silicone rubber composites with SiC_w oriented structure were prepared. When the oriented SiC_w reaches 10wt%, the thermal conductivity can be increased by 72% compared with pure silicone rubber, and it is 40% higher than that filled with non-oriented 10wt%SiC_w. Compared with pure silicone rubber, the volume resistivity decreases by two orders of magnitude. But it still has good insulation. The silicone rubber composites with randomly dispersed and oriented SiC_w were simulated by COMSOL. The simulation results show that the thermal conductivity of silicone rubber can be improved by 60% with 10wt%SiC_w. The volume resistivity is above 10¹⁵ Ω∙cm. However, 10wt% oriented SiC_w can improve the thermal conductivity of silicone rubber by 170% and the volume resistivity is above 10¹⁴ Ω∙cm. It is consistent with the trend of experimental results.