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聚多巴胺改性纳米二氧化硅增强反式-1, 4-聚异戊二烯形状记忆聚合物的制备与性能

张闯 张静 王娜 李龙

张闯, 张静, 王娜, 等. 聚多巴胺改性纳米二氧化硅增强反式-1, 4-聚异戊二烯形状记忆聚合物的制备与性能[J]. 复合材料学报, 2023, 40(5): 2772-2782. doi: 10.13801/j.cnki.fhclxb.20220616.002
引用本文: 张闯, 张静, 王娜, 等. 聚多巴胺改性纳米二氧化硅增强反式-1, 4-聚异戊二烯形状记忆聚合物的制备与性能[J]. 复合材料学报, 2023, 40(5): 2772-2782. doi: 10.13801/j.cnki.fhclxb.20220616.002
ZHANG Chuang, ZHANG Jing, WANG Na, et al. Preparation and properties of polydopamine modified nano-silica reinforced trans-1, 4-polyisoprene shape memory polymers[J]. Acta Materiae Compositae Sinica, 2023, 40(5): 2772-2782. doi: 10.13801/j.cnki.fhclxb.20220616.002
Citation: ZHANG Chuang, ZHANG Jing, WANG Na, et al. Preparation and properties of polydopamine modified nano-silica reinforced trans-1, 4-polyisoprene shape memory polymers[J]. Acta Materiae Compositae Sinica, 2023, 40(5): 2772-2782. doi: 10.13801/j.cnki.fhclxb.20220616.002

聚多巴胺改性纳米二氧化硅增强反式-1, 4-聚异戊二烯形状记忆聚合物的制备与性能

doi: 10.13801/j.cnki.fhclxb.20220616.002
基金项目: 国家重点研发计划“科技冬奥”(2019YFF0302004);辽宁省“兴辽英才计划”项目(XLYC2005002);2021年辽宁省“揭榜挂帅”科技攻关项目(2021JH1/10400091);沈阳市科学技术计划-重大关键核心技术攻关专项(20-202-1-15);辽宁省教育厅科学研究经费项目(LJKZ0436)
详细信息
    通讯作者:

    王娜,博士,教授,硕士生/博士生导师,研究方向为功能高分子复合材料 E-mail: iamwangna@syuct.edu.cn;

    李龙,博士,讲师,硕士生导师,研究方向为功能高分子材料 E-mail: lilong@syuct.edu.cn

  • 中图分类号: TB332

Preparation and properties of polydopamine modified nano-silica reinforced trans-1, 4-polyisoprene shape memory polymers

Funds: National Key Research and Development Program "Science and Technology Winter Olympics" (2019YFF0302004); Liaoning Xingliao Talents Program (XLYC2005002); 2021 Science and Technology Research Project of Liaoning Province (2021JH1/10400091); Shenyang Science and Technology Plan-Major Key and Core Technology Research Project (20-202-1-15); Scientific Research Fund of Education Department of Liaoning Province (LJKZ0436)
  • 摘要: 由于形状记忆聚合物(SMP)较低的力学强度,不足以满足现今大多数商用复合材料的使用标准,严重限制了其在许多高级应用中的使用。因此,为制备高性能SMP复合材料,利用聚多巴胺(PDA)对纳米SiO2进行表面改性,制备了一种新型纳米填料SiO2@PDA,并通过SEM、XPS和FTIR对其结构和性能进行了表征。将SiO2和SiO2@PDA作为纳米填料填充到反式-1, 4-聚异戊二烯(TPI)中,制备了TPI形状记忆复合材料,系统的研究了TPI/SiO2和TPI/SiO2@PDA复合材料的热稳定性、力学性能和形状记忆性能。结果表明:PDA修饰增强了SiO2在TPI基体中的分散性和界面相互作用,从而使TPI/SiO2@PDA复合材料的热稳定性、力学性能得到提升的同时仍能够保持良好的形状记忆性能。当SiO2@PDA含量为1.5% (以TPI的质量为基准,下同)时,TPI复合材料的冲击强度和拉伸强度达到最大值,分别比纯TPI提高了43.5%和25%。此外,复合材料固定率(Rf)和回复率(Rr)均超过97%。

     

  • 图  1  SiO2@聚多巴胺(PDA)制备工艺示意图

    Figure  1.  Schematic of preparation process for SiO2@polydopamine (PDA)

    图  2  SiO2、PDA和SiO2@PDA的红外图谱

    Figure  2.  FTIR spectra of SiO2, PDA and SiO2@PDA

    图  3  (a) SiO2和SiO2@PDA的XPS全谱;((b)~(d)) SiO2@PDA的N1s、O1s和Si2p的XPS图谱

    Figure  3.  (a) XPS survey specrta of SiO2 and SiO2@PDA; ((b)-(d)) N1s, O1s and Si2p XPS spectra of SiO2@PDA

    图  4  SiO2 (a)和SiO2@PDA (b)的SEM图像

    Figure  4.  SEM images of SiO2 (a) and SiO2@PDA (b)

    图  5  反式-1, 4-聚异戊二烯(TPI)形状记忆复合材料的DSC曲线:(a)结晶过程;(b)熔融过程

    Figure  5.  DSC curves of trans-1, 4-polyisoprene (TPI) shape memory composites: (a) Crystallization; (b) Melting process

    图  6  TPI形状记忆复合材料的XRD图谱

    Figure  6.  XRD patterns of TPI shape memory composites

    图  7  TPI形状记忆复合材料的TG分析曲线

    Figure  7.  TG analysis of TPI shape memory composites

    图  8  TPI形状记忆复合材料的力学性能:(a) 应力-应变曲线;(b) 拉伸强度及断裂伸长率

    Figure  8.  Mechanical properties of TPI shape memory composites: (a) Stress-strain curves; (b) Tensile strength and elongation at break

    图  9  TPI形状记忆复合材料的冲击强度测试

    Figure  9.  Impact strength test of TPI shape memory composites

    图  10  TPI形状记忆复合材料的DMA曲线

    Figure  10.  DMA curves of TPI shape memory composites

    图  11  TPI形状记忆复合材料的形状记忆特性曲线

    Figure  11.  Shape memory characteristic curves of the TPI shape memory composites

    表  1  反式-1, 4-聚异戊二烯(TPI)复合材料的命名

    Table  1.   Naming of trans-1, 4-polyisoprene (TPI) composites

    Sample TPI/g SiO2/g SiO2@PDA/g
    Neat TPI 100
    TPI/SiO2-0.5 g 100 0.5
    TPI/SiO2@PDA-0.5 g 100 0.5
    TPI/SiO2@PDA-1.0 g 100 1.0
    TPI/SiO2@PDA-1.5 g 100 1.5
    TPI/SiO2@PDA-2.0 g 100 2.0
    下载: 导出CSV

    表  2  TPI复合材料的DSC测试数据

    Table  2.   DSC test data of TPI composites

    SampleXc/%Tm/℃Tc/℃Hm/(J·g-1)
    Neat TPI14.0340.087.6226.21
    TPI/SiO2-0.5 g13.7740.331.0625.72
    TPI/SiO2@PDA-0.5 g14.7641.185.2727.58
    TPI/SiO2@PDA-1.0 g15.2841.687.3228.55
    TPI/SiO2@PDA-1.5 g15.8042.368.8929.53
    TPI/SiO2@PDA-2.0 g15.2041.465.5328.40
    Note: Xc, Tm, Tc and ∆Hm—Crystallinity, crystallization temperature, melting temperature and melting enthalpy of TPI shape memory composites, respectively.
    下载: 导出CSV

    表  3  TPI形状记忆复合材料的TG测试数据

    Table  3.   TG test data for TPI shape memory composites

    SampleT5%/℃Tmax/℃W600/wt%
    Neat TPI277.13371.212.39
    TPI/SiO2-0.5 g310.36372.534.62
    TPI/SiO2@PDA-0.5 g318.93373.685.52
    TPI/SiO2@PDA-1.0 g323.88375.385.75
    TPI/SiO2@PDA-1.5 g326.46379.069.12
    TPI/SiO2@PDA-2.0 g320.95376.456.39
    Notes: T5% and Tmax—Initial degradation temperature and maximum degradation temperature of TPI shape memory composites; W600—Mass fraction of residual carbon at 600℃.
    下载: 导出CSV

    表  4  TPI形状记忆复合材料的形状记忆测试数据

    Table  4.   Shape memory test data for TPI shape memory composites

    SampleRf/%Rr/%
    Neat TPI98.798.8
    TPI/SiO2-0.5 g98.398.1
    TPI/SiO2@PDA-0.5 g98.698.5
    TPI/SiO2@PDA-2.0 g98.597.9
    Note: Rf and Rr—Shape fixation rate and shape recovery rate of TPI shape memory composites, respectively.
    下载: 导出CSV
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出版历程
  • 收稿日期:  2022-05-09
  • 修回日期:  2022-05-31
  • 录用日期:  2022-06-03
  • 网络出版日期:  2022-06-16
  • 刊出日期:  2023-05-15

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