Investigation of the bonding performance of a protein dispersed carbon nanotube/epoxy adhesive
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摘要: 碳纳米管/环氧树脂因其优良的力学与粘结性能可广泛应用于航空航天等高端领域结构件的胶结连接。然而如何有效降低碳纳米管的团聚性，保证制备工艺的低成本与绿色环保是该纳米粘结剂能够实际应用的关键。为此，本文提出一种基于蛋白质分散的碳纳米管增强环氧树脂粘接剂并对其粘结性能进行了研究。结果表明：经过酸或碱性环境变性处理的大豆分离蛋白能够有效降低碳纳米管的团聚性并显著提高环氧树脂的粘接性能，当碳纳米管质量分数为0.1wt%时，经酸、碱性处理的大豆分离蛋白-碳纳米管/环氧树脂粘结剂的粘结性能增幅分别为26.6%、26.7%；而当碳纳米管质量分数增加到0.3wt%时，两种处理方法的大豆分离蛋白-碳纳米管/环氧树脂粘结剂的粘结性能增幅分别为10.2%和18.3%，碱处理结果比酸处理提升79%。
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关键词:
- 碳纤维增强树脂基复合材料 /
- 大豆分离蛋白 /
- 粘接性能 /
- 改性 /
- 表面处理
Abstract: Carbon nanotube (CNT)/epoxy resin can be widely used to bond advanced structural parts in the aerospace field due to its excellent mechanical and bonding properties. However, how to effectively reduce the agglomeration of carbon nanotubes and ensure low cost and environmental protection of the preparation process is the key to the practical application of the nano-binder. Therefore, this paper proposes a protein dispersed carbon nanotube reinforced epoxy resin adhesive and investigates its bonding performance. The results show that the soy protein isolate (SPI) after a certain acid or alkali denaturation treatment can effectively reduce the agglomeration of carbon nanotubes and significantly improve the bonding performance of epoxy resin. When the CNT loading is 0.1wt%, the bonding property of acid and alkali treated SPI-CNT/epoxy is increased by 26.6% and 26.7%. While the CNT loading increases to 0.3wt%, the bonding property enhancement of the two treated methods comes to 10.2% and 18.3%, the alkali method is 79% higher than the acid one. -
图 1 碳纤维粘接板: (a)碳纤板与玻纤组合；(b)粘接板固化、切割；(c)粘接板三点弯实验；(d)粘接板实物组成图
Figure 1. Carbon fiber bonding board: (a) Carbon fiber board and glass fiber combination; (b) Bonding board curing and cutting; (c) Three-point bending experiment of bonding board; (d) Diagram of bonding board physical composition
图 3 (a)质量分数0.1wt%下不同改性处理CNT动态散射实验测量粒子直径；(b) 图3(a)局部放大图；(c)静置一周后测量改性CNT粒子直径
SPI—Soy protein isolate; CNT—Carbon nanotube
Figure 3. (a) Particle diameters measured by dynamic scattering experiments of CNT with different modification treatments; (b) Partial enlarged view of Fig. 3(a); (c) Particle diameters of modified CNT measured after standing for a week
图 4 质量分数0.1wt%下不同改性处理CNT与原始大豆分离蛋白的FTIR图谱
Figure 4. FTIR spectra of different modified CNTs and raw soybean protein isolates at 0.1wt% mass fraction
图 5 升温速率为20 K/min下不同改性处理CNT与原始大豆分离蛋白热重实验结果
Figure 5. Thermogravimetric experimental results of different modified CNTs and raw soybean protein isolate at a heating rate of 20 K/min
图 6 质量分数0.1wt% ((a)~(c))、0.3wt% ((d)~(f))下未改性CNT粘接剂粘接头断裂过程
Figure 6. Fracture process of unmodified CNT adhesive at mass fraction of 0.1wt% ((a)-(c)) and 0.3wt% ((d)-(f))
图 7 不同质量分数下未改性CNT增强粘接剂失效形式与失效载荷
Figure 7. Failure modes and failure loads of unmodified CNT-reinforced adhesives under different mass fractions
图 8 质量分数0.1wt%蛋白质酸((a)~(c))、碱((d)~(f))改性CNT增强粘接剂粘接头断裂过程
Figure 8. Fracture process of bond joints of 0.1wt% protein acid ((a)-(c)), base ((d)-(f)) modified CNT-reinforced adhesive
图 9 质量分数0.1wt%、0.3wt%酸碱变性处理下CNT增强粘接剂胶结头失效载荷
Figure 9. Failure load of CNT-reinforced adhesive bonding head under acid-base denaturation treatment with mass fraction of 0.1wt% and 0.3wt%
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