[1] |
姜海涛, 崔健磊, 殷东平, 等. 雷达功率组件的金刚石微通道热沉激光加工工艺[J]. 中国机械工程, 2021, 32(3):261-268. doi: 10.3969/j.issn.1004-132X.2021.03.002JIANG Haitao, CUI Jianlei, YIN Dongping, et al. Femtosecond laser processing technology of diamond micro-channel heat sink based on radar power module[J]. China Mechanical Engineering,2021,32(3):261-268(in Chinese). doi: 10.3969/j.issn.1004-132X.2021.03.002
|
[2] |
ZWEBEN C. Advances in high-performance thermal mana-gement materials: A review[J]. Journal of Advanced Materials,2007,39:3-10.
|
[3] |
AZINA C, ROGER J, JOULAIN A, et al. Solid-liquid co-existent phase process: Towards fully dense and thermally efficient Cu/C composite materials[J]. Journal of Alloys and Compounds,2018,738:292-300. doi: 10.1016/j.jallcom.2017.12.196
|
[4] |
GANIJA M, OTTAWAY D, VEITCH P, et al. Cryogenic, high power, near diffraction limited, Yb: YAG slab laser[J]. Optics Express,2013,21(6):6973-6978. doi: 10.1364/OE.21.006973
|
[5] |
CHEN M H, LI H Z, WANG C R, et al. Progress in heat conduction of diamond/Cu composites with high thermal conductivity[J]. Rare Metal Materials and Engineering,2020,49(12):4146-4158.
|
[6] |
NOSAEVA K, AL-SAWAF T, JOHN W, et al. Multifinger indium phosphide double-heterostructure transistor circuit technology with integrated diamond heat sink layer[J]. IEEE Transactions on Electron Devices,2016,63(5):1-7.
|
[7] |
AZMI K, DERMAN M N, BAKRI A, et al. Cu-SiCp compo-sites as advanced electronic packaging materials[J]. Key Engineering Materials,2014,594-595:852-856.
|
[8] |
YOSHIDA K, MORIGAMI H. Thermal properties of diamond/copper composite material[J]. Microelectronics Reliability,2004,44(2):303-308. doi: 10.1016/S0026-2714(03)00215-4
|
[9] |
WEBER L, TAVANGAR R. On the influence of active element content on the thermal conductivity and thermal expansion of Cu–X (X = Cr, B) diamond composites[J]. Scripta Materialia,2007,57(11):988-991. doi: 10.1016/j.scriptamat.2007.08.007
|
[10] |
ROSINSKI M, CINPIUSKI L J, GRZONKA A, et al. Synthesis and characterization of the diamond/copper composites produced by the pulse plasma sintering (PPS) method[J]. Diamond and Related Materials,2012,27-28:29-35. doi: 10.1016/j.diamond.2012.05.008
|
[11] |
ABYZOV A, KRUSZEWSKI M, CIUPINSKI L, et al. Diamond-tungsten based coating–copper composites with high thermal conductivity produced by Pulse Plasma Sintering[J]. Materials & Design,2015,76:97-109.
|
[12] |
HELL J, CHIRTOC M, EISENMENGER-SITTNER C, et al. Characterisation of sputter deposited niobium and boron interlayer in the copper–diamond system[J]. Surface & Coatings Technology,2012,208:24-31.
|
[13] |
LI H Z, WANG C R, WU L M, et al. Optimization of process parameters, microstructure, and thermal conductivity properties of Ti-coated diamond/copper composites prepared by spark plasma sintering[J]. Journal of Materials Science: Materials in Electronics,2021,32:9115-9125. doi: 10.1007/s10854-021-05579-1
|
[14] |
PAN Y P, HE X B, REN S B, et al. Optimized thermal conductivity of diamond/Cu composite prepared with tungsten-copper-coated diamond particles by vacuum sintering technique[J]. Vacuum,2018,153:74-81. doi: 10.1016/j.vacuum.2018.03.052
|
[15] |
PATRYCJUSZ M, DOMINIAK A, ROMAN D, et al. Thermal conductivity enhancement of copper–diamond composites by sintering with chromium additive[J]. Journal of Thermal Analysis and Calorimetry,2013,116(2):881-885.
|
[16] |
王艳辉. 金刚石磨料表面镀钛层的制备、结构、性能及应用[D]. 秦皇岛: 燕山大学, 2003.WANG Yanhui. Preparation, structure, properties and applications of titanium coating on diamond abrasive[D]. Qinhuangdao: Yanshan University, 2003(in Chinese).
|
[17] |
张纯, 王日初, 彭超群, 等. 表面镀钨层对金刚石/铜复合材料热导率的影响[J]. 稀有金属材料与工程, 2016, 45(10):2692-2696.ZHANG Chun, WANG Richu, PENG Chaoqun, et al. Effects of tungsten coating layer on thermal conductivity of diamond-copper composites[J]. Rare Metal Materials and Engineering,2016,45(10):2692-2696(in Chinese).
|
[18] |
李毅, 于爱兵, 洪鑫, 等. 旋转摩擦挤压加温法制备金刚石表面Ti涂层[J]. 复合材料学报, 2022, 39(1):292-301.LI Yi, YU Aibing, HONG Xin, et al. Fabrication of Ti layer on diamond surface with rotary friction extrusion heating method[J]. Acta Materiae Compositae Sinica,2022,39(1):292-301(in Chinese).
|
[19] |
WANG C R, LI H Z, CHEN M H, et al. Microstructure and thermo-physical properties of Cu-Ti double-layer coated diamond/Cu composites fabricated by spark plasma sintering[J]. Diamond and Related Materials,2020,109:108041. doi: 10.1016/j.diamond.2020.108041
|
[20] |
GRZONKA J, KRUSZEWSKI M J, ROSIŃSKI M, et al. Interfacial microstructure of copper/diamond composites fabricated via a powder metallurgical route[J]. Materials Characterization,2015,99:188-194. doi: 10.1016/j.matchar.2014.11.032
|
[21] |
CIUPIŃSKI L, KRUSZEWSKI M, GRZONKA J, et al. Design of interfacial Cr3C2, carbide layer via optimization of sintering parameters used to fabricate copper/diamond compo-sites for thermal management applications[J]. Materials & Design,2017,120:170-185.
|
[22] |
HE J S, WANG X T, ZHANG Y, et al. Thermal conductivity of Cu-Zr/diamond composites produced by high tempera-ture-high pressure method[J]. Composites Part B: Engi-neering,2015,68:22-26. doi: 10.1016/j.compositesb.2014.08.023
|
[23] |
ZHANG H L, WU J H, ZHANG Y, et al. Effect of metal matrix alloying on mechanical strength of diamond particle-reinforced aluminum composites[J]. Journal of Materials Engineering and Performance,2015,24(6):2556-2562. doi: 10.1007/s11665-015-1527-9
|
[24] |
BAI G Z, WANG L H, ZHANG Y J, et al. Tailoring interface structure and enhancing thermal conductivity of Cu/diamond composites by alloying boron to the Cu matrix[J]. Materials Characterization,2019,152:265-275. doi: 10.1016/j.matchar.2019.04.015
|
[25] |
HARKINS W D. Energy relations of the surface of solids I. Surface energy of the diamond[J]. The Journal of Chemi-cal Physics,1942,10(5):268-272. doi: 10.1063/1.1723719
|
[26] |
ZHANG H D, ZHANG J J, LIU Y, et al. Unveiling the interfacial configuration in diamond/Cu composites by using statistical analysis of metallized diamond surface[J]. Scripta Materialia,2018,152:84-88. doi: 10.1016/j.scriptamat.2018.04.021
|
[27] |
MA S D, ZHAO N Q, SHI C S, et al. Mo2C coating on diamond: Different effects on thermal conductivity of diamond/Al and diamond/Cu composites[J]. Applied Surface Science,2017,402:372-383. doi: 10.1016/j.apsusc.2017.01.078
|
[28] |
WANG Y L, DUAN K Y, WANG K K, et al. Structure and thermal properties of layered Ti-clad diamond/Cu compo-sites prepared by SPS and HP[J]. Rare Metal Materials and Engineering,2018,47(7):2011-2016. doi: 10.1016/S1875-5372(18)30173-5
|
[29] |
YUSHIN D I, SMIRNOV A V, SOLIS P, et al. Modeling process of spark plasma sintering of powder materials by finite element method[J]. Materials Science Forum,2015,834:41-50. doi: 10.4028/www.scientific.net/MSF.834.41
|
[30] |
MIZUUCHI K, INOUE K, AGARI Y, et al. Effect of boron addition on the thermal conductivity of Cu/diamond compo-sites fabricated by SPS[J]. Journal of the Japan Society of Powder & Powder Metallurgy,2015,62(1):27-34.
|
[31] |
MIZUUCHI K, INOUE K, AGARI Y, et al. Thermal conductivity of diamond particle dispersed aluminum matrix composites fabricated in solid–liquid co-existent state by SPS[J]. Composites Part B: Engineering,2011,42(5):1029-1034. doi: 10.1016/j.compositesb.2011.03.028
|
[32] |
CHEN H, JIA C C, LI S J, et al. Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy compo-sites prepared by HPHT technique[J]. International Jour-nal of Minerals, Metallurgy, and Materials,2012,19(4):364-371. doi: 10.1007/s12613-012-0565-7
|
[33] |
XIN L, TIAN X, YANG W S, et al. Enhanced stability of the diamond/Al composites by W coatings prepared by the magnetron sputtering method[J]. Journal of Alloys and Compounds,2018,763:305-313. doi: 10.1016/j.jallcom.2018.05.310
|
[34] |
CHUPRINA V G. Physicochemical interaction and structure development during the formation of metal gas-transfer coatings on diamond (review). 1. Kinetics[J]. Soviet Powder Metallurgy & Metal Ceramics,1992,31(7):578-583.
|
[35] |
闫建明. 金刚石/铜复合材料的界面调控和导热性能研究[D]. 郑州: 郑州大学, 2018.YAN Jianming. Study on interface control and thermal conductivity of diamond/Cu composites[D]. Zhengzhou: Zhengzhou University, 2018(in Chinese).
|
[36] |
ZHANG C, WANG R C, CAI Z Y. Effects of dual-layer coatings on microstructure and thermal conductivity of diamond/Cu composites prepared by vacuum hot pressing[J]. Surface and Coatings Technology,2015,277:299-307. doi: 10.1016/j.surfcoat.2015.07.059
|
[37] |
JIA J H, BAI S X, XIONG D G, et al. Effect of tungsten based coating characteristics on microstructure and thermal conductivity of diamond/Cu composites prepared by pressueless infiltration[J]. Ceramics International,2019,45:10810-10818. doi: 10.1016/j.ceramint.2019.02.156
|
[38] |
CHANG R, ZANG J B, WANG Y H, et al. Preparation of the gradient Mo layers on diamond grits by spark plasma sintering and their effect on Fe-based matrix diamond composites[J]. Journal of Alloys and Compounds,2017,695:70-75. doi: 10.1016/j.jallcom.2016.10.172
|
[39] |
GU M Y, ZHANG G D, WU R J. Interfacial bondings in Grf/Al composites[J]. Progress in Natural Science Material International,1997,7:600.
|
[40] |
CHU K, LIU Z F, JIA C C, et al. Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles[J]. Journal of Alloys and Compounds,2010,529:453-458.
|
[41] |
王海鹏, 彭坤. 基体中Ti元素含量对金刚石/Cu-Ti复合材料热导率的影响[J]. 复合材料学报, 2018, 35(4):910-919.WANG Haipeng, PENG Kun. Influence of minor Ti addition in matrix on the thermal conductivity of diamond/Cu-Ti composites[J]. Acta Materiae Compositae Sinica,2018,35(4):910-919(in Chinese).
|
[42] |
CHU K, JIA C C, GUO H, et al. Microstructure and thermal conductivity of Cu-B/diamond composites[J]. Journal of Composite Materials,2013,47(23):2945-2953. doi: 10.1177/0021998312460259
|