Microstructure and properties of functionalized Al2O3@SiO2/phenolic epoxy-bismaleimide composites
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摘要: 采用溶胶-凝胶法(Sol-gel)分别制备Al2O3和SiO2,同时以KH560为架桥剂制得SiO2包覆Al2O3(KH560-Al2O3@SiO2)的增强体。以双马来酰亚胺树脂和酚醛环氧树脂(MBMI-EPN)为基体、4’4-二氨基二苯甲烷(DDM)为固化剂,采用原位聚合法制备了KH560-Al2O3@SiO2/MBMI-EPN复合材料;表征KH560-Al2O3@SiO2的微观结构及该增强体对复合材料性能的影响。结果表明:Al2O3@SiO2粒子微观结构清晰,核壳结构完整,内核为短纤维状Al2O3,外壳为无定形SiO2,二者通过化学键方式相连;Al2O3@SiO2表面成功接枝上KH560基团,粒子堆积现象减弱。KH560-Al2O3@SiO2/MBMI-EPN复合材料的微观形貌显示:KH560-Al2O3@SiO2在MBMI-EPN基体中形成多相结构、分散性较好、界面作用稳定且断面形貌呈鱼鳞状,并未发现Al2O3@SiO2粒子团聚体,整体结构完整。当KH560-Al2O3@SiO2含量为1.5wt%时,复合材料的弯曲强度与冲击强度分别为126 MPa和14.7 kJ/m2,比树脂基体分别提高了21.2%和27.8%;材料的热分解温度为392.3℃,比树脂基体提高了14.5℃,力学性能和耐热性得到明显改善。Abstract: The Al2O3 and SiO2 were obtained by sol-gel method and the KH560-Al2O3@SiO2 were prepared with KH560 as the coupling agent. The KH560-Al2O3@SiO2/MBMI-EPN composites were prepared by in-situ polymerization, using bismaleimide resin and phenolic epoxy resin (MBMI-EPN) as matrix, KH560-Al2O3@SiO2 as the reinforcement and 4’4-diaminodiphenylmethane (DDM) as curing agent. The micro-structure of KH560-Al2O3@SiO2 were characterized and the effect of the reinforcement on properties of composites were studied. The results show that the Al2O3@SiO2 particles have clear core-shell structure. The short-fiber Al2O3 is inner core, and the amorphous SiO2 is outer shell, which are connected by chemical bonds. The KH560 is successfully grafted onto the surface of Al2O3@SiO2, and the particles packing phenomenon is weakened. The micro-structure of the composites shows that KH560-Al2O3@SiO2 forms a multi-phase structure in the MBMI-EPN matrix with good dispersion and stable interface. The cross-sectional shape is fish scale, and there are no Al2O3@SiO2 nanoparticle agglomerates and the overall structure is regular. When the content of KH560-Al2O3@SiO2 is 1.5wt%, bending strength and impact strength of the composites are 126 MPa and 14.7 kJ/m2, which are 21.2% and 27.8% higher than resin matrix, respectively. And the thermal decomposition temperature of the composites is 392.3℃, which is 14.5℃ higher than that of resin matrix.
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Key words:
- phenolic epoxy resin /
- bismaleimide /
- alumina, silicon oxide /
- mechanical properties /
- heat resistance /
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表 1 KH560-Al2O3@SiO2/双马来酰亚胺树脂-酚醛环氧树脂(MBMI-EPN)复合材料样品的名称及组分含量
Table 1. Sample name and content of KH560-Al2O3@SiO2/bismaleimide resin and phenolic epoxy resin (MBMI-EPN) composites
Sample KH560-Al2O3@SiO2
mass ratio/wt%MBMI-EPN 0 0.5wt% KH560-Al2O3@SiO2/MBMI-EPN 0.5 1.0wt% KH560-Al2O3@SiO2/MBMI-EPN 1.0 1.5wt% KH560-Al2O3@SiO2/MBMI-EPN 1.5 2.0wt% KH560-Al2O3@SiO2/MBMI-EPN 2.0 2.5wt% KH560-Al2O3@SiO2/MBMI-EPN 2.5 -
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