Structure adjustment and properties of carbon nanotube film interlaminar modified carbon fiber/bismaleimide composites
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摘要: 对比研究了热塑性层间增韧和碳纳米管(CNT)膜层间混杂碳纤维(CF)/双马来酰亚胺复合材料不同层间结构调控方法，分析了其复合材料的压缩、动态力学、导电和电磁屏蔽等性能的变化。结果表明，热密实可显著降低层间CNT膜的厚度，抑制其局部富树脂程度，CNT膜-CF混杂复合材料的压缩强度得以提升，其压缩断口形貌明显不同于初始的CF复合材料。对比而言，热塑性树脂层间增韧CF复合材料的压缩强度明显低于CNT膜/CF混杂复合材料。CNT膜的加入贯通了混杂复合材料的层间导电通路，其厚度方向电导率提高了3个数量级，然而不同复合材料的体积电导率则表现出明显的“木桶效应”。值得关注的是，CNT膜层间混杂对提高CF复合材料的电磁屏蔽特性作用显著，其中致密CNT膜混杂复合材料的电磁屏蔽效能可达到90 dB。Abstract: The interlayer structure adjusting methods were studied on carbon fiber (CF)/bismaleimide composite materials, conducted respectively by thermoplastic interlaminar toughening and carbon nanotube (CNT) film hybridizing in contrast. The changes of compression properties, dynamic mechanical properties, electrical conductivities and electromagnetic shielding properties of the modified CF composites were analyzed. The results show that thermal compaction processing reduces the thickness of the CNT film significantly, suppressing the local resin-rich of the interlayer CNT region. The compressive strengths of the CNT film-CF hybrid composites are improved, with the fracture morphologies obviously different from that of the CF composites. In comparison, the thermoplastic interlaminar toughened CF composites show much lower compression strengths than the CNT film/CF hybrid composites. Additionally, the interlaminar electrical conductive paths are penetrated by the CNT networks of the hybrid composites, hence the thickness direction conductivities are increased by 3 orders of magnitude. However, the volumetric electrical conductivities of the diverse hybrid composites exhibit an evident “Cannikin Law”. It is noteworthy that the CNT film interlaminar hybrid can dramatically improve the electromagnetic shielding properties of the CF composite, reaching up to 90 dB for the dense CNT film hybrid composite.
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图 1 碳纳米管(CNT)膜-T800/双马来酰亚胺(BMI)预浸料密实方法示意图
Figure 1. Schematic diagram of carbon nanotube (CNT) film-T800/bismaleimide (BMI) prepreg compaction method
图 2 复合材料表面电导率测试示意图
Figure 2. Schematic diagram of surface conductivity test for the composites
图 3 不同密实工艺处理后CNT膜的厚度与表观形貌
Figure 3. Thickness and surface morphology of CNT film after different compaction processing
图 4 不同密实工艺CNT膜SEM图像与取向性对比
Figure 4. SEM images and the orientation characterization of CNT films after different compaction processing
IG∥/IG⊥—Ratio of the parallel and vertical Raman spectrum intensity
图 5 不同密实工艺制备的CF复合材料层间树脂区与CNT膜的平均厚度
Figure 5. Average thickness of interlayer resin and CNT film of CF composites prepared by different compaction processing methods
图 6 不同层间结构复合材料的压缩强度与破坏形貌
Figure 6. Compressive strengths and failure morphologies of different interlayer structure adjusted composites
图 7 不同层间结构复合材料的动态力学性能
Figure 7. Dynamic mechanical properties of different interlayer structure adjusted composites
图 8 不同层间结构复合材料沿0°方向的电导率
Figure 8. Conductivities of different interlayer structure adjusted composites along the direction of 0°
图 9 不同层面结构复合材料沿90°方向的电导率
Figure 9. Conductivities of different interlayer structure adjusted composites along the direction of 90°
图 10 不同层间结构复合材料的电磁屏蔽性能
Figure 10. Electromagnetic shielding performance of different interlayer structure adjusted composites
图 11 不同层间结构复合材料厚度方向的电流导通与电磁屏蔽吸收机制示意图
Figure 11. Schematic diagram of the current conduction and absorption mechanism in electromagnetic shielding of different interlayer structure adjusted composites along the thickness direction
表 1 不同复合材料试样的标号、组成及密实复合工艺
Table 1. List of different composite samples including the main constituents, the combination and compaction process
Label Material Compaction method T0 Toughened prepreg No T-CNT Toughened prepreg+CNT film No T-CNT-C Toughened prepreg+CNT film Cold compaction T-CNT-H Toughened prepreg+CNT film Heat compaction L0 Normal prepreg No L-CNT-H Normal prepreg+CNT film Heat compaction 
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