基于真空热压扩散法的金刚石/Ti界面生成机制

袁建东; 于爱兵; 孙磊; 王燕琳; 迟剑英

doi:10.13801/j.cnki.fhclxb.20200519.001

基于真空热压扩散法的金刚石/Ti界面生成机制

doi: 10.13801/j.cnki.fhclxb.20200519.001

袁建东^1,,
于爱兵^1, ,,
孙磊^1,,
王燕琳^2,,
迟剑英^1,

1.
宁波大学　机械工程与力学学院，宁波 315211
2.
宁波大学　信息科学与工程学院，宁波 315211

基金项目: 国家自然科学基金(51875294)；宁波市自然科学基金(2018A610153)；宁波市科技创新2025重大专项(2018B10006)

详细信息

通讯作者:
于爱兵，博士，教授，博士生导师，研究方向为切削加工技术及表面工程　E-mail：yuaibing@nbu.edu.cn

中图分类号: TB3333
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出版历程
- 收稿日期: 2020-01-21
- 录用日期: 2020-05-14
- 网络出版日期: 2020-05-19
- 刊出日期: 2020-12-15

Formation mechanism of diamond/Ti interface based on vacuum hotpressing diffusion method

YUAN Jiandong^1
,,
YU Aibing^{1
, ,},
SUN Lei^1
,,
WANG Yanlin^2
,,
CHI Jianying^1
,

1.
Faculty of Mechanical Engineering and Mechanics, Ningbo University, Ningbo 315211, China
2.
Faculty of Information Science and Engineering, Ningbo University, Ningbo 315211, China

摘要

摘要: 采用真空热压扩散法在聚晶金刚石表面制备Ti层，探究金刚石表面金属化过程中的界面生成机制。利用扫描电子显微镜和X射线衍射仪，分析了钛层的表面形貌、界面结构和界面间的物相组成，采用能谱仪对界面进行了元素分析，计算了聚晶金刚石与Ti层之间界面的扩散带宽度及生成TiC的化学反应吉布斯自由能变。研究结果表明：在聚晶金刚石表面形成了平整、致密的Ti层，在聚晶金刚石与Ti层界面之间存在C、Ti和Co元素的扩散，在结合界面处产生了一定宽度的元素扩散带，同时在金刚石表面生成了点状TiC。真空热压扩散法实现了金刚石与Ti层的化学结合，可以提高金刚石与Ti层的结合强度。
- 热压扩散 /
- 界面 /
- 生成机制 /
- 金刚石 /
- Ti
Abstract: With the vacuum hot pressing diffusion method, Ti coating layer was prepared on the surface of polycrystalline diamond to investigate the formation mechanism of the interface during diamond metallization. The surface morphology, interface structure and phase composition of the Ti coating layer were analyzed with a scanning electron microscope and an X-ray diffractometer. The interfacial elements were analyzed with an energy disperse spectrometer. The width of the element diffusion zone between polycrystalline diamond and Ti layer and the free enthalpy change for the chemical reaction to generate TiC were calculated. The research results show that flat and dense Ti layer is formed on the surface of polycrystalline diamond. There is diffusion of carbon, Ti and cobalt elements on bonding interface between Ti coating layer and polycrystalline diamond. An element diffusion zone with a certain width is generated on bonding interface. At the same time, spot-shaped TiC particles are formed on diamond surface. The vacuum hot pressing diffusion method can realize a chemical combination between diamond grain and a Ti layer, and can improve the bonding strength between diamond grain and Ti layer.
- hotpressing diffusion /
- interface /
- formation mechanism /
- diamond /
- Ti

HTML全文

图 1 真空热压扩散实验的试样装夹示意图

Figure 1. Schematic diagram of specimen clamping for vacuum hot pressing diffusion method

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图 2 Ti层表面的SEM图像

Figure 2. SEM image of Ti coating layer

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图 3 PCD/Ti界面的SEM图像

Figure 3. SEM images of PCD/Ti interface

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图 4 PCD与Ti层的界面EDS结果

Figure 4. EDS analysis of interface between PCD and Ti layer

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图 5 PCD与Ti层的界面EDS能谱分析

Figure 5. EDS spectra analysis of interface between PCD and Ti layer

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图 6 C在Ti中的扩散系数D与温度T的关系

Figure 6. Relationship between C diffusion coefficient D and temperature T in Ti

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图 7 镀Ti与未镀Ti的PCD表面形貌对比

Figure 7. Comparison of PCD surface morphologies with coating of Ti and without coating

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图 8 不同区域的PCD表面XRD图谱

Figure 8. XRD patterns of PCD surface on different regions

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图 9 图7中表面形貌的局部放大

Figure 9. Local magnification images of surface morphologies in Fig. 7

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图 10 PCD与Ti箔的真空热压扩散过程示意图

Figure 10. Schematic diagrams of vacuum hot pressing diffusion processes between PCD and Ti film

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表 1 钛箔和PCD的化学成分

Table 1. Chemical composition of TA1 and PCD

Material	C/wt%	Fe/wt%	Ti/wt%	Co/wt%	W/wt%	Si/wt%	N/wt%	H/wt%
TA1	0.01	0.05	99.87	—	—	0.05	0.015	0.005
PCD	88.12	—	—	8.99	2.89	—	—	—
Notes: TA1—Pure titanium grade TA1；PCD—Polycrystalline diamond.

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