Abstract:
Functionalized SiC particle-SiC whisker (SiC
P-SiC
W) hybrid fillers by γ-glycidoxypropyltrimethoxysilane (KH-560) were performed to fabricate the functionalized SiC
P-SiC
W/bismaleimide (SiC
P-SiC
W/BMI) thermal conductivity composites,BMI as the polymeric matrix and diallylbisphenol A (DABA) as a toughening agent,respectively.Effects of the shape,content,compound and surface functionalization of SiC fillers on the thermal conductivities,dielectric & mechanical properties and thermal stabilities of the functionalized SiC
P-SiC
W/BMI thermal conductivity composites were investigated.The results show that the functionalized SiC
P-SiC
W/BMI thermal conductivity composite with 40wt% functionalized SiC
P-SiC
W(1:3,mass ratio) hybrid fillers exhibits the best comprehensive performance,the corresponding thermally conductive coefficient
λ of 1.125 W (m·K)
-1,dielectric constant
ε of 4.12,and 5wt% thermal mass loss temperature of 427℃.
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