Abstract: Copper cartridge casings are costly and restricted by national copper reserves, and high-performance Cu-Al composite plates are promising alternatives. This work explores the rolling process effects on microstructure and properties of T2Cu-1060Al-T2Cu composite plates, in which TX/a%-TY/b% refers to the first pass at X℃ with a% reduction and the second pass at Y℃ with b% reduction. After rolling, the interlayer diffusion layer fractures along the rolling direction, with the phase sequence from Cu to Al being Cu₉Al₄, CuAl and CuAl₂. The T20/50%-T350/33% sample has the thickest diffusion layer of 6.9 μm with no interfacial pores; the diffusion layer thickness of T350/50% and T350/67% is 6.2 μm and 5.8 μm, and their interfacial pores are far smaller than those of T20/50%, indicating that multi-pass hot rolling with small reduction boosts interfacial element diffusion and coordinated deformation of matrix and diffusion layers. For rolled samples with a total reduction of 67%, most Al grains show 111 orientation while interfacial Al presents 101 orientation, owing to Cu-induced stress constraint on interfacial Al from matrix property differences. Rolling greatly reduces the Brass texture intensity on the Cu side; T350/67% has stronger textures including S and Copper textures on Cu and near-interface Al sides and β-fiber texture on distant Al sides, proving small-reduction multi-pass rolling weakens texture. Overall, small-reduction multi-pass hot rolling promotes interfacial diffusion, relieves texture, coordinates interfacial deformation, and improves tensile strength of Cu-Al composite plates without reducing elongation.