SiCf/SiC陶瓷基复合材料磨削用砂轮加工性能研究

A Study on the Machining Performance of Grinding Wheels for Grinding SiCf/SiC Ceramic Matrix Composites

  • 摘要: 为了揭示碳化硅纤维增强碳化硅陶瓷基复合材料(SiCf/SiC)磨削工具的加工范围及加工性能,本文研究了不同磨削参数下,钎焊金刚石工具与电镀金刚石工具磨削SiCf/SiC的加工性能与磨削表面质量。结果表明,在50 µm和100 µm磨削深度下,电镀金刚石工具磨削表面粗糙度更小,而在200 µm和400 µm磨削深度下,钎焊金刚石工具磨削表面粗糙度比电镀金刚石工具磨削表面最高低20%以上;此外,采用钎焊金刚石工具的磨削力整体上相比电镀金刚石工具的小50%以上,并且钎焊金刚石工具耐磨性更好。因此,钎焊金刚石工具更适用于200-400 µm大磨削深度加工,而电镀金刚石工具则适用于100 µm以下磨削深度的加工。本研究为SiCf/SiC磨削工具选型提供了明确的参数依据。

     

    Abstract: To reveal the suitable machining parameter range and performance of grinding tools for silicon carbide fiber-reinforced silicon carbide (SiCf/SiC) ceramic matrix composites, the machining performance and ground surface quality of brazed and electroplated diamond tools when grinding SiCf/SiC composites under different grinding parameters were investigated in this study. Results indicate that at grinding depths of 50 µm and 100 µm, the electroplated diamond tool yields lower surface roughness. While at depths of 200 µm and 400 µm, the brazed diamond tool produces over 20% lower surface roughness than those by the electroplated tool. Furthermore, using the brazed diamond tool generates generally more than 50% lower grinding forces than using the electroplated tool. The brazed diamond tool exhibits superior wear resistance. Therefore, the brazed diamond tool is more suitable for heavy grinding operations at depths of 200–400 µm, whereas the electroplated diamond tool is better suited for grinding depths below 100 µm. This study provides clear parameter selection of grinding tools for machining SiCf/SiC ceramic matrix composites.

     

/

返回文章
返回