GaInSn/MXene固液协同增强PVA/硼砂基复合水凝胶的制备及应用

Preparation and Application of GaInSn/MXene Solid-Liquid Synergistic Reinforced PVA/Borax-Based Composite Hydrogel

  • 摘要: 柔性可穿戴传感器用导电水凝胶常面临由于刚性填料引起的“力-电”制约,以及受损后微观电学通路难以彻底自愈的难题。为攻克上述瓶颈,基于“固液协同”微观网络组装策略,对兼具极速力电重构与高灵敏传感特性的新型复合水凝胶进行了研究。以聚乙烯醇(PVA)为基体,硼砂为动态交联剂,将液态金属(GaInSn)与二维MXene共混,通过冷冻-解冻循环制备了PVA-Borax-GaInSn-MXene水凝胶。结果表明,液态金属的随动形变与MXene的刚性支撑协同增韧了高分子网络,其断裂拉伸应力达205 kPa,断裂伸长率达420%,体积韧性高达430 kJ/m3。电学测试表明,该凝胶具备217 ms的响应时间,并在近500次的连续形变循环中保持优越的信号稳定性。此外,凭借微观物理互锁与多级化学键合机制,材料对多种基材展现出良好的黏附力;断裂时,受损面依靠动态硼酸酯键与微观“液桥”效应在室温下融合,实现了力电性能的高效同步自愈合。该固液协同策略有效克服了传统刚性导电网络愈合率低下的缺陷,为长寿命、高保真柔性电子器件的设计提供了全新的材料范式。

     

    Abstract: Conductive hydrogels for flexible wearable sensors often suffer from a “force-electricity” trade-off caused by rigid fillers, along with the difficulty of fully restoring microscopic electrical pathways after damage. To address these challenges, a novel composite hydrogel with rapid mechano-electrical reconstruction and high sensing sensitivity was developed based on a “solid-liquid synergy” micro-network assembly strategy. Using polyvinyl alcohol (PVA) as the matrix and borax as a dynamic crosslinker, liquid metal (GaInSn) and two-dimensional MXene were incorporated via freeze–thaw cycles to fabricate a PVA-Borax-GaInSn-MXene hydrogel. The results demonstrate that the deformability of liquid metal and the rigid support of MXene synergistically toughen the polymer network, achieving a fracture stress of 205 kPa, elongation at break of 420%, and a high toughness of 430 kJ/m3. Electrical characterization shows a fast response time of 217 ms and excellent signal stability over nearly 500 deformation cycles. Furthermore, owing to the combined effects of microscopic physical interlocking and multilevel chemical bonding, the hydrogel exhibits strong adhesion to various substrates. Upon fracture, the damaged interfaces can autonomously reconnect at room temperature through dynamic borate ester bonds and a microscopic “liquid bridge” effect, enabling efficient simultaneous recovery of mechanical and electrical properties. This solid–liquid synergistic strategy effectively overcomes the low healing efficiency of conventional rigid conductive networks, offering a new material paradigm for the design of long-lifetime, high-fidelity flexible electronic devices.

     

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