铜与Al2O3陶瓷的粘接

JOINING OF ALUMINA CERAMICS TO COPPER

  • 摘要: 用自制的装置研究了高温下铜与Al2O3陶瓷的直接粘接,重点考察了温度和压力对界面粘接强度的影响。在温度725℃,压力7.5MPa,粘接时间300s的条件下,获得最大粘接强度为15.1MPa。

     

    Abstract: Joining of alumina ceramics to copper was investigated with a self-made producing device. Studies were focused on temperatures, pressures and interfacial cohesive strength. The highest joining strenth of 15.1 MPa was obtained for the sample under the conditions of 725 ℃ for joining temperature, 7.5 MPa for joining pressure and 300 s for joining time.

     

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