Abstract: Film/substrate structure is a basic structure widely used in microelectronic and materials science and technology. The residual stress in the film induced by mechanical and thermal mismatch in the manufacture is an important cause of initiation and extension of interface cracks. The modified three-parameter (Γ₀, /σ_y,t) cohesive model was used to investigate the cleavage fracture under plastic atmosphere, the stress distribution in crack tip, the shape and physiognomy of crack tip and the influence of the parameter on the fracture process. The model was also used to discuss the whole process of the initiation and extension of an interface crack between a uniform metal thin film and a ceramic substrate under residual stresses.