C/C密度梯度材料的热学及力学性能研究

张守阳, 李贺军, 孙军

张守阳, 李贺军, 孙军. C/C密度梯度材料的热学及力学性能研究[J]. 复合材料学报, 2002, 19(5): 43-46.
引用本文: 张守阳, 李贺军, 孙军. C/C密度梯度材料的热学及力学性能研究[J]. 复合材料学报, 2002, 19(5): 43-46.
ZHANG Shou-yang, LI He-jun, SUN Jun. THERMAL PROPERTIES AND MECHANICAL PROPERTIES OF DENSITY GRADIENT CARBON/CARBON COMPOSITES[J]. Acta Materiae Compositae Sinica, 2002, 19(5): 43-46.
Citation: ZHANG Shou-yang, LI He-jun, SUN Jun. THERMAL PROPERTIES AND MECHANICAL PROPERTIES OF DENSITY GRADIENT CARBON/CARBON COMPOSITES[J]. Acta Materiae Compositae Sinica, 2002, 19(5): 43-46.

C/C密度梯度材料的热学及力学性能研究

基金项目: 国家自然科学基金资助项目(59882004);国防预研基金资助项目(99J12.5.2, HK0311)
详细信息
    作者简介:

    张守阳(1971),男,博士,博士后,主要研究方向为C/C复合材料的快速CVI制备技术。

  • 中图分类号: TB332

THERMAL PROPERTIES AND MECHANICAL PROPERTIES OF DENSITY GRADIENT CARBON/CARBON COMPOSITES

  • 摘要: C/C密度梯度材料的研究在国内尚属于空白,本文作者研究了C/C复合材料的导热系数与密度间的关系,并对比密度均匀材料与密度梯度材料的导热系数和力学性能,从理论上探索C/C密度梯度材料的应用前景。为进一步开发C/C密度梯度材料提供了理论依据。
    Abstract: As a high performance thermal-resistant composite, carbon/carbon composites have the highest mechanical strength in the temperature above 1600℃, and the research of C/C gradient materials will extend the application of C/C as a kind of heat insulation in high temperature. To get some information concerning applying density gradient materials, thermal conductivities (with different densities and under various temperatures) were measured. In order to provide a theory in the application of density gradient carbon/carbon composites(C/C), the relationship between these thermal conductivity and density/temperature was summarized; the mechanical properties of 2DC/C and density gradient C/C were investigated. In conclusion, the relationship between the thermal conductivity and density approximately accords with linearity in the experimental range. Density gradient C/C has higher flexural strength and lower thermal conductivity than uniform C/C, which infers that the materials have superiority in heat insulation and structural application.
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出版历程
  • 收稿日期:  2001-02-15
  • 修回日期:  2001-06-12
  • 刊出日期:  2002-10-14

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