SHS/QP制备(TiB<sub>2</sub>+Fe)/Fe叠层材料的结构与性能分析

SHS/QP制备(TiB₂+Fe)/Fe叠层材料的结构与性能分析

摘要: 采用SHS/QP工艺制备了(TiB₂+Fe)/Fe叠层材料。SEM分析表明TiB₂+Fe金属陶瓷层结构致密。用EPMA研究了TiB₂+Fe金属陶瓷层与Fe基片之间的界面连接机制,结果表明TiB₂从TiB₂+Fe侧向Fe基片侧进行扩散,以及TiB₂+Fe层中的Fe粘结相和Fe基片的粘接完成了(TiB₂+Fe)/Fe叠层材料的界面连接。叠层材料接头断裂时,断裂位置发生在TiB₂+Fe金属陶瓷层,而不是沿着TiB₂+Fe层与Fe基片的界面断裂。

Abstract: (TiB₂+Fe)/Fe layered materials were fabricated by SHS/QP process. SEM analysis showed TiB₂+Fe cermet layer in the layered material was fully dense. Interfacial bonding between TiB₂+Fe cermet and Fe substrate was analyzed by EPMA, which showed the interfacial bonding of two-layered product was obtained by the dissolution and the diffusion of TiB₂ in the Fe substrate and joining of Fe binder with Fe substrate. The fracture of joints took place in the TiB₂+Fe cermet layer rather than at the interface.