SHS/QP制备(TiB2+Fe)/Fe叠层材料的温度场与应力场分析
FABRICATION OF (TiB2+Fe)/Fe LAYERED MATERIALS BY SHS/QP PROCESS——ANALYSIS OF TEMPERATURE FIELD AND STRESS FIELD
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摘要: 采用有限元分析方法,研究SHS/QP技术制备叠层材料过程中试样的温度分布和变化,为工艺参数的选择和试样界面结构分析提供参考。有限元计算表明SHS反应层厚度增加时,Fe基片界面处温度升高,Fe以液相存在的时间延长。采用有限元分析方法计算叠层材料残余热应力,叠层材料中TiB2+Fe金属陶瓷层与Fe基片的界面结合处径向边缘出现轴向应力和剪切应力的奇异点,导致在这个区域出现应力集中。Abstract: Temperature field and stress field in (TiB2+Fe)/Fe layered materials fabricated by self-propagating high-temperature synthesis plus quick pressing (SHS/QP) were analyzed. Finite element analysis shows that the temperature of Fe substrate at the interface increases and liquid Fe exists longer with the increase of the thickness of SHS layer. The peculiar point of the axial stress and shear stress is located at the peripheral area of the bonding boundary of (TiB2+Fe)/Fe two-layered sample and this peculiar point would be considered as the major reason for the exfoliation between the bonding boundaries.