DI-N-M-ACETYLENE-PHENYLPHTHALIMIDE-ETHER MODIFYING METHYL-DI-PHENYLACETYLENE-SILANE
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摘要: 甲基二苯乙炔基硅烷 (MDPES) 聚合后具有耐高温、低介电损耗等优异性能,但力学性能低。采用双 (N-间乙炔基苯基邻苯二甲酰亚胺) 醚 (DAIE) 添加到MDPES中进行共聚改性。通过二者不同质量配比的共聚反应发现,当MDAIE /MMDPES=4∶5时,共聚后改性效果较好,在氮气中的Td5 (质量损失5% 时的温度) 为467℃,800℃时质量保留率为82.7%,所制备的复合材料在常温下弯曲强度达到274MPa;高温弯曲强度保留率为88.5%。在频率为1MHz时介电常数为4.18,介电损耗角正切tanδ为2.5×10-3。Abstract: Polymer of methyl-di-phenylacetylene-silane (MDPES) possesses excellent properties of high temperature-resistance, low dielectric dissipation fraction, etc, but its mechanical property is not significant for its poor bonding with glass-fiber. The di-N-m-acetylene-phenylphthalimide-ether(DAIE) was added into MDPES to modify its properties through copolymerization. To research copolymerization of DAIE and MDPES at different mass ratios, it was found that when MDAIE/MMDPES was 4∶5, the value of Td5 ( temperature of 5% weight loss) is 467℃ in nitrogen; its mass residual ratio is 82.7% based on the initial mass at 800℃ in nitrogen; the flexural strength at room temperature is 274MPa; the flexural strength at 235℃ is 241MPa; the flexural strength retention at 235℃ is 88.5%; its permittivity is 4.18 and tanδ is 2.5×10-3 in the frequency of 1MHz.
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