2D C/SiC缺陷的无损检测与评价

Nondestructive testing and evaluation of 2D C/SiC with defects

  • 摘要: 采用化学气相渗透法制备了内置异物质缺陷的2D C/SiC复合材料,利用红外热成像、X射线照相和计算机断层扫描(工业CT)三种技术对C/SiC试样进行无损检测。研究了内置缺陷试样的三点弯曲性能。结果表明:X射线照相适用于检测试样中有明显密度差异的缺陷;红外热成像检测适用于检测材料中导热系数较差的孔洞及分层缺陷;工业CT可以检测材料的局部横截面密度差异、孔洞和分层等缺陷的细节特征。2D C/SiC材料在受弯曲载荷时,容易从内置异物质缺陷处开裂,且随该缺陷长度增加,其抗弯强度及临界裂纹扩展能降低。

     

    Abstract: The 2D C/SiC plate seeded with the defects was manufactured by the chemical vapor infiltration (CVI) process. The C/SiC plate with defects was examined using three Nondestructive Testing (NDT) technologies: thermography,X-ray radiography and computed tomography. The flexural properties of the sample with the defect were also investigated. The results show that X-ray radiographic technology is applicable to examine the defects with different densities,thermographic technology can be applicable to test the defects with poor thermal diffusivity such as the pores and delaminations,and industrial computed tomographic technology is applicable to detect the exact localization,in particular the visualization of the depth and thickness of the defects. It is found that the 2D C/SiC samples can easily crack and delaminate in the interface between matrix and defect under loading. With increasing the defect length,the flexural strength of the samples and the crack propagation energy decrease.

     

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