Abstract: The high thermal conductivity SiC_P/Al electronic packaging materials were successfully prepared by the spark plasma sintering (SPS) process. The effects of sintering temperature and holding time on the microstructure of  SiC_P/Al  composites were researched. And thermo-physical characteristics of final composites were also evaluated. The results show that the thermal conductivity of 70 vol % SiC_P/Al composites fabricated by SPS is 195. 5 W· (m·K)^-1, which corresponds to that of 15 %W₂Cu and decuples that of Kovar alloy; the density is 3. 0 g·cm^-3; the thermal expansion coefficient (CTE) is 6. 8 ×10^-6 K^-1, which is close to the subst rate materials; and the bend st rength is 410 MPa, tensile strength is 190 MPa, satisfying the electronic packaging materials needs in thermal and mechanics properties.