RFI工艺用环氧树脂膜的制备及其化学流变特性

Preparation and chemorheology of epoxy resin film used in RFI process

  • 摘要: 为研制低成本树脂膜熔渗(RFI)工艺用环氧树脂膜 , 以环氧树脂 E51、高温潜伏性固化剂三氟化硼单乙胺和乙二醇为原料 , 采用正交设计方法对配方进行优化 , 并通过控制预聚反应程度的方法进行合成实验。对所研制树脂膜的化学流变特性进行测试研究 , 结果表明 , 树脂膜在130℃工作温度下 , 最低黏度达360 mPa· s , 小于1000 mPa· s的低黏度时间达 32 min , 凝胶时间为 48 min , 并且室温不粘手 , 可任意弯曲 , 适用于RFI工艺。通过不同升温速率的DSC扫描 , 分析了预聚原液和树脂膜的反应活化能 , 发现树脂膜反应活化能比预聚原液高 , 而且树脂膜的反应活化能随着固化度增加而增加。以双 Arrhenius公式为理论基础建立了树脂膜黏度和凝胶时间的预测函数 , 实验结果表明二者均具有良好的适用性。根据 RFI工艺对黏度的要求创立了熔渗力因子的表达方程 , 并通过该方程确定了理论最佳熔渗温度为128. 4 ℃。

     

    Abstract: In order to develop an epoxy matrix resin film used in the low-cost technique of RFI , a new resin film was synthesized with epoxy of E51 , high temperature latent curing agent BF3-400 and ethylene glycol , through optimizing the ingredient s by the orthogonal design method and controlling the primary reaction degree. The results of the research on its chemorheology show that the least viscosity of this resin film reaches 360 mPa· s , the time of low viscosity below 1000 mPa· s is up to 32 min , and the gel time is 48 min at 130℃ work temperature. The resin film is not sticky and has good flexibility at 25℃ room temperature. Through DSC scanning with different temperature rising rates , the activation energy Eα of the original resin system and that of the resin film were analyzed. It is found that the Eα of the resin film is greater than that of the other one , and increases with the rising of cure degree. Based on the double Arrhenius theory , the prediction function of viscosity and the prediction function of gel time which are both proved to have good applicability by tests were established. According to the viscosity requirement of RFI process , a function for the infusion coefficient is set up , and the optimal theoretical infusion temperature 128. 4 ℃is found.

     

/

返回文章
返回