树脂富集区对复合材料多向板I型分层断裂行为的影响

Effect of resin-rich zone on fracture behavior of mode-I delamination of multi-directional laminates

  • 摘要: 双悬臂梁(Double Cantilever Beam,DCB)试验是测定复合材料层合板I型层间断裂能最主要方法。针对DCB试样因铺贴聚四氟乙烯薄膜预制分层产生树脂富集区对I型断裂能计算不准确的问题,本文设计三种铺层角度(0//0,0//45,0//90)的DCB试验,采用扫描电镜表征DCB裂纹断面的微观形貌,量化树脂富集影响区域,研究三种工况树脂富集对载荷-位移曲线的非线性行为的影响规律。建立含树脂富集区和纤维桥接扩展区的DCB数值模型,开展量化分析解释和揭示树脂富集区对断裂能R曲线的影响规律。试验结果表明:三种铺层角度对应的树脂富集区的长度明显不同,0//0试样最长,0//90试样最短。树脂富集区和纤维桥接扩展区的耦合作用,导致载荷-位移曲线呈现不同的非线性行为。构建的数值分析模型可以准确预测与试验一致的载荷-位移曲线,验证了树脂富集区对I型分层初始断裂韧性的影响规律。

     

    Abstract: The Double Cantilever Beam (DCB) test is the most primary method for determining the interlaminar fracture energy of composite laminate mode-I. In order to address the issue of inaccurate calculation of the mode-I fracture energy due to the resin-rich zone generated by prefabricated delamination from laying polytetrafluoroethylene film for DCB specimens, DCB tests with three laying angles (0//0,0//45,0//90) were designed and scanning electron microscopy was used to characterize the microstructure of DCB crack surfaces. the influence mechanism of resin-rich zone was quantified, and the nonlinear behavior of load-displacement curves under three working conditions of resin enrichment was studied. A numerical model of the DCB containing resin-rich zone and fiber bridging propagation zone was established to conduct quantitative analysis, interpretation, and reveal the mechanisms of the resin-rich zone on the fracture energy R curve. Experimental results show that the lengths of resin-rich zone corresponding to the three laying angles are significantly different, with the 0//0 specimen being the longest and the 0//90 specimen being the shortest. The coupling effect between the resin-rich zone and fiber bridging propagation zone results in different nonlinear behaviors in the load-displacement curves. The constructed numerical analysis model can accurately predict load-displacement curves consistent with experiments, verifying the influence of resin-rich zone on the initial fracture toughness of mode-I layer.

     

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