SiCf/SiC陶瓷基复合材料分层缺陷低频超声识别优化

Optimization of Low-Frequency Ultrasonic Detection of Delamination in SiCf/SiC Ceramic Matrix Composites

  • 摘要: 陶瓷基复合材料(CMC)在制造过程中易产生内部缺陷,显著影响其性能。超声检测技术被广泛应用于CMC缺陷检测,但由于CMC内部存在大量编织孔隙,导致超声波衰减严重,尤其是在高频条件下。为确保超声信号的穿透性,通常需要降低频率,然而这会导致缺陷识别精度下降。本研究采用有限元模拟方法,分析了三种不同低频超声波在CMC中的传播特性和声场分布,旨在选择适用于CMC分层缺陷检测的最佳低频超声波。有限元结果表明,与0.5 MHz和2 MHz相比,1 MHz超声波可有效减少散射效应,同时提高检测精度。随后,采用1 MHz的超声波对含有人工缺陷的SiCf/SiC CMC试样进行了检测。结果表明,1 MHz的超声波能够有效降低CMC内部编织孔隙对超声信号的衰减与干扰,并可有效识别长度大于2 mm的分层缺陷。

     

    Abstract: Ceramic matrix composites (CMC) are prone to internal defects during manufacturing, which significantly affect their performance. Ultrasonic detection has been widely used for detecting such defects. However, the numerous woven pores within CMC cause severe attenuation of ultrasonic waves, particularly at high frequencies. To ensure adequate signal penetration, lower frequencies are often employed, although this compromises the accuracy of defect detection. This study employed finite element simulations to analyze the propagation characteristics and acoustic field distributions of three different low-frequency ultrasonic waves in CMC, with the goal of identifying the optimal frequency for detecting delamination defects. The finite element results demonstrate that, compared to 0.5 MHz and 2 MHz, 1 MHz ultrasound effectively reduces scattering effects while enhancing detection accuracy. Subsequently, SiCf/SiC CMC specimens with artificial defects were inspected using the selected frequency. Results indicate that 1 MHz ultrasound effectively reduces attenuation and interference with ultrasonic signals caused by the woven pores within CMC, enabling reliable detection of delamination defects larger than 2 mm.

     

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