高韧可溶杂萘联苯聚芳醚的合成与性能

Synthesis and properties of high-toughness soluble phthalazinone poly(aryl ether)

  • 摘要: 针对杂萘联苯聚芳醚砜酮(PPESK)因分子链刚性较强而导致本征韧性不足的问题,本文开展了高韧可溶杂萘联苯聚芳醚树脂的分子设计、合成及性能研究。基于分子动力学仿真构建无定型聚合物分子链本征柔性理论模型,通过自由体积分数(FFV)、均方位移(MSD)、内聚能密度(CED)及分子间相互作用能等参数评价链段柔性。以“刚柔并济”为设计原则,采用4,4-双(4-羟苯基)戊酸(DPA)部分取代二氮杂萘酮联苯双酚(DHPZ),在保留杂萘联苯刚性骨架的基础上,引入柔性烷烃侧链和羧基结构,并通过高温溶液亲核取代缩聚法制备了新型高韧可溶杂萘联苯聚芳醚树脂PPEDSK。傅里叶红外光谱(FTIR)和核磁共振分析(1H-NMR)表征结果证实目标聚合物成功合成。与PPESK相比,PPEDSK的拉伸强度提高16.7%,断裂伸长率提高20%,缺口冲击强度提升了约145.5%;其玻璃化转变温度为265℃,热分解温度为461℃,仍保持良好耐热性,并在多种极性溶剂中表现出优异溶解性。该研究为高性能可溶聚芳醚树脂在反复大变形折叠/展开结构及先进复合材料领域的应用提供了材料基础。

     

    Abstract: Addressing the issue of insufficient intrinsic toughness in poly(phthalazinone ether sulfone ketone) (PPESK) due to its strong molecular chain rigidity, this paper conducts research on the molecular design, synthesis, and properties of a high-toughness soluble poly(phthalazinone ether) resin. Based on molecular dynamics simulations, a theoretical model of the intrinsic flexibility of amorphous polymer molecular chains is constructed. The segment flexibility is evaluated using parameters such as free volume fraction (FFV), mean square displacement (MSD), cohesive energy density (CED), and intermolecular interaction energy. Adopting the design principle of "combining rigidity and flexibility", 4,4-bis(4-hydroxyphenyl)pentanoic acid (DPA) is used to partially replace dihydrazinopyranone biphenyl (DHPZ). On the basis of retaining the rigid skeleton of phthalazinone, flexible alkane side chains and carboxyl structures are introduced. A novel high-toughness soluble poly(phthalazinone ether) resin, PPEDSK, is prepared through a high-temperature solution nucleophilic substitution polycondensation method. Fourier Transform Infrared Spectroscopy (FTIR) and Nuclear Magnetic Resonance analysis (1H-NMR) characterization results confirm the successful synthesis of the target polymer. Compared to PPESK, PPEDSK exhibits an increase in tensile strength by 16.7%, an increase in elongation at break by 20%, and an increase in notch impact strength by approximately 145.5%. Its glass transition temperature is 265℃, and its thermal decomposition temperature is 461℃, maintaining good heat resistance. It also demonstrates excellent solubility in various polar solvents. This research provides a material basis for the application of high-performance soluble poly(aryl ether) resins in the field of repeatedly large deformation folding/unfolding structures and advanced composite materials.

     

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