用于环氧树脂多性能协同优化的环氧封端含氟超支化聚醚醚酮设计与性能研究

Design and Performance of Epoxy-Terminated Fluorinated Hyperbranched Poly(ether ether ketone) for the Synergistic Optimization of Multiple Properties of Epoxy Resins

  • 摘要: 为提高环氧树脂的韧性并改善其介电性能和表面性能,本文设计并合成了一种环氧封端含氟超支化聚醚醚酮(HPEEK-EO),并将其作为反应型改性剂引入4,4’-二氨基二环己基甲烷/双酚A型环氧树脂(PACM/E44)体系。采用溶液共混-热固化法制备了不同HPEEK-EO添加量的改性样条,并系统研究了其力学性能、热性能、介电性能、表面性能及断裂面形貌。结果表明,适量的HPEEK-EO能够有效提升改性体系的综合性能。其中,当添加量为3wt.%时,拉伸强度提高至89.4 MPa;弯曲强度提高至136.4 MPa;冲击强度达到44.45 kJ/m2,较PACM/E44体系提高123.9%。热重与差示扫描量热分析表明,各改性样条的5%热失重温度均维持在约340℃,玻璃化转变温度最高达到94.3℃,表明体系在增韧的同时仍保持了较好的热稳定性。动态热机械分析表明,适量引入HPEEK-EO可提高体系在玻璃态区的储能模量,并改善高温下的模量保持能力。在介电性能方面,1 MHz下介电常数由3.96降至2.80,且中高频段介电损耗因子有所降低;在表面性能方面,随着HPEEK-EO添加量增加,试样水接触角由77.32°提高至102.67°,表面自由能由38.38 mJ/m2降至30.02 mJ/m2,表面疏水性明显增强。SEM结果显示,改性试样断裂面粗糙度明显增加,裂纹扩展路径发生偏转,并出现局部撕裂痕迹,说明材料在断裂过程中经历了更多能量耗散。研究表明,HPEEK-EO作为一种含氟反应型超支化改性剂,可实现环氧树脂力学、热性能、介电及表面性能的协同调控,为高性能环氧树脂的多功能改性提供了新的思路。

     

    Abstract: To improve the toughness, dielectric properties, and surface hydrophobicity of epoxy resins, an epoxy-terminated fluorinated hyperbranched poly(ether ether ketone) (HPEEK-EO) was designed and synthesized, and then introduced as a reactive modifier into a bisphenol A epoxy resin cured with 4,4′-diaminodicyclohexylmethane (PACM). Composite specimens containing different amounts of HPEEK-EO were prepared by solution blending followed by thermal curing, and their mechanical, thermal, dielectric, and surface properties, as well as fracture morphology, were systematically investigated. The results showed that an appropriate amount of HPEEK-EO effectively improved the overall properties of the cured system. At a loading of 3wt.%, the tensile strength, flexural strength, and impact strength reached 89.4 MPa, 136.4 MPa, and 44.45 kJ/m2, respectively, corresponding to a 123.9% increase in impact strength compared with the unmodified PACM/E44 system. Thermogravimetric analysis and differential scanning calorimetry showed that the 5% weight-loss temperature of all composite specimens remained around 340℃, while the highest glass transition temperature reached 94.3℃, indicating that good thermal stability was retained after toughening. Dynamic mechanical analysis further revealed that the incorporation of an appropriate amount of HPEEK-EO improved the storage modulus in the glassy region and the modulus retention at elevated temperatures. In terms of dielectric performance, the dielectric constant decreased from 3.96 to 2.80 at 1 MHz, and the dielectric loss was reduced in the medium-to-high frequency range. In terms of surface properties, with increasing HPEEK-EO content, the water contact angle increased from 77.32° to 102.67°, whereas the surface free energy decreased from 38.38 to 30.02 mJ/m2, indicating markedly enhanced hydrophobicity. SEM observations revealed rougher fracture surfaces, crack deflection, and local tearing features in the modified specimens, suggesting greater energy dissipation during fracture. These results demonstrate that HPEEK-EO, as a fluorinated reactive hyperbranched modifier, enables the synergistic tuning of the mechanical, thermal, dielectric, and surface properties of epoxy resins, providing a useful molecular design strategy for the multifunctional modification of high-performance epoxy materials.

     

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