Abstract: This study fabricated single-, double-, triple-pin, and other multi-pin joints of 2D C/SiC composites using chemical vapor infiltration and conducted tensile tests to systematically investigate the load distribution mechanism under different multi-pin configurations. The results indicate that increasing the number of pins significantly enhances the tensile strength of longitudinally arranged joints, with the triple-pin configuration achieving a strength of 87.8 MPa—approximately three times that of the single-pin joint. In contrast, the transversely arranged multi-pin joints showed no improvement in strength, maintaining around 27.0 MPa; the triple-pin transverse configuration showed marginally lower strength than the single-pin joint due to variations in the pin-hole interface bonding strength. Strain monitoring around the holes revealed uniform load distribution in transverse rows and a sequential load-bearing mechanism in longitudinal rows. The longitudinal configurations maintained stiffness consistent with the single-pin joint, yet exhibited multiplied failure strength and displacement with increasing pin count. Acoustic emission monitoring further validated this mechanism, showing a 35 s interval between failures of the two pins in a double-pin longitudinal joint without altering the mechanical response trend. Cluster analysis of acoustic emission signals identified damage modes such as fiber fracture, matrix cracking, interfacial friction, and fiber crushing, providing critical experimental and theoretical support for elucidating the failure mechanisms and optimizing the performance of C/SiC composite joints.