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单分散无溶剂纳米SiO2流体对环氧树脂的改性

Modified epoxy with monodispersed solvent-free nano SiO2 fluid

    摘要
  • 摘要: 以纳米粒子SiO2为核、表面活性剂N,N-十二基-N-甲基-N-(3-三甲氧基甲硅烷基丙基)氯化铵(SID3392)为颈状层、聚(乙二醇)4-壬基苯基醚3-磺丙基钾盐(PEGS)为冠状层,制备出了无溶剂纳米SiO2流体。无溶剂纳米SiO2流体为牛顿流体,在室温下具有较低的黏度,在26.5 ℃时其黏度为4.3 Pa·s,无溶剂纳米SiO2流体中SiO2的含量为13.65wt%。将该无溶剂纳米SiO2流体加入环氧树脂中,制备了无溶剂纳米SiO2流体/环氧树脂复合材料。TEM结果表明: 无溶剂纳米SiO2流体在环氧树脂基体中具有良好的分散性。DSC测试表明: 无溶剂纳米SiO2流体的加入会略微降低环氧树脂的固化温度。当纳米SiO2流体加入量为2.5wt%时,复合材料的冲击性能提高了164.7%,玻璃化温度提高了15.4 ℃。断面SEM结果显示无溶剂纳米SiO2流体能够提高环氧树脂的韧性。

     

    Abstract: The solvent-free nano SiO2 fluid was prepared with nanoparticle SiO2 as the core, N,N-didecyl-N-methyl-N-(3-trimethoxysilylpropyl) ammonium chloride (SID3392) as the necklayer and poly(ethylene glycol) 4-nonylphenyl3-sulfopropyl ether potassium salt (PEGS) as the canopy.The solvent-free nano SiO2 fluid is a Newtonian fluid with low viscosity at room temperature, and its viscosity is 4.3 Pa·s at 26.5 ℃.The mass fraction of SiO2 in the solvent-free nano SiO2 fluid is 13.65%.The solvent-free nano SiO2 fluid is loaded in the epoxy matrix to prepare solvent-free nano SiO2 fluid/epoxy composites.The TEM results confirm that the solvent-free nano SiO2 fluid disperses well in the epoxy matrix.DSC test shows that the solvent-free nano SiO2 fluid can decrease the curing temperature of the epoxy.When the content of solvent-free nano SiO2 fluid in the composites reaches up to 2.5wt%, the impact properties of the epoxy is improved up to 164.7%.The glass transition temperature is improved by 15.4 ℃.The SEM results of fracture surface also confirm that solvent-free nano SiO2 fluid can improve the toughness of epoxy.

     

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