低损耗ZrTi2O6填充PTFE复合基板性能

Properties of low loss ZrTi2O6 filled PTFE composite substrates

  • 摘要: 采用热压成型工艺,制备了一种低损耗ZrTi2O6陶瓷填充聚四氟乙烯(PTFE)的新型微波复合基板材料。采用介质谐振器法研究了ZrTi2O6/PTFE复合材料的微波介电性能(8~12 GHz)。结果表明,ZrTi2O6/PTFE复合材料的相对介电常数(ε r)和介电损耗(tanδ)随着ZrTi2O6陶瓷体积分数(0~46%)的增加而增大,介电常数实验值与Lichtenecker模型预测值最吻合。ZrTi2O6/PTFE复合材料的热膨胀系数和介电常数温度系数随着ZrTi2O6陶瓷体积分数的增加而减小。46%的ZrTi2O6为较优填料比例,ZrTi2O6/PTFE的相对介电常数为7.42,介电损耗为0.0022(10 GHz)。

     

    Abstract: A new kind of low loss ZrTi2O6 filled polytetrafluoroethylene (PTFE) microwave composite substrates were fabricated through the hot-pressing process. The microwave dielectric properties of the composites were measured using dielectric resonator method (18-12 GHz). The relative permittivity (εr) and loss tangent (tanδ) of the composites increase with an increase of the volume fraction of ZrTi2O6 ceramic (0-46%). The experimental dielectric constants of the composites match well with the theoretically predicted values using Lichtenecker model. As the volume fraction of ZrTi2O6 ceramic increases, the thermal expansion coefficient and the temperature coefficient of dielectric constant decrease. The ZrTi2O6/PTFE composites exhibit a dielectric constant of 7.42 with a loss tangent of 0.0022 (10 GHz) at an optimum filler volume fraction of 46% ZrTi2O6.

     

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