光弹性贴片法测定复合材料的孔边应力
STRESS ANALYSIS AROUND A HOLE IN COMPÓSITES BY USING PHOTOELASTICCOATING METHOD
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摘要: 本文根据复合材料各向异性的特性,对光弹性贴片法测试复合材料板无载孔的孔边应力,作了分析和实验研究.推导出光弹性贴片法测量复合材料孔边应力的基本公式,泊松比失配和贴片增强效应的修正公式.最后,对理论值与测试值进行了比较,符合较好.Abstract: Stress distributions around a no-lcadiing hole in composites is theore tically and experimentally investigated by the use of photoelastic-coating method. Governing equationa in the method are developed accerding to the essential principles in photoelasting method and the mechanies of composite. materials-Correction factors for unmatched Possion's ratios and coating reinforcement effects are added to the governing equations Experimental results for carbon fiber reinforced epoxy and glass fiber reinforced epoxy composites show that there exists good agreement between the experimental results and theoretical results introducing the correction factors to the unmatched Possions ratios It is also found that thereinforcement effect of the coatincs is very small and can be neglected.