复合材料胶粘剂固化反应及工艺参数的研究
STUDY OF CURING REACTION AND TECHNOLOGY PARAMETERS OF COMPOSITE ADHESIVE
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摘要: 本文用PERKIN-ELMER公司(简称P-E公司)的DSC-7仪器测定了SY—25胶膜的固化反应.根据DSC测试原理建立的动力学方程,通过DSC—7动力学软件,求出SY-25胶膜的固化反应动力学参数-固化反应表观活化能(Ea)、反应级数(n)以及表观频率因子(Z).利用已得到的动力学参数值,进一步预测SY-25胶膜的固化反应程度(α)、固化反应温度(TcAbstract: The paper is about measuriug curing ruction of SY-25 adhcsiv DSC-7 of PFRKIN-ELMER Company.Kinetic parameters of curing reaction activation energy, reaction order and pre-exponcntial factor can be obtained based on the kinetic equation which is constructed.in accordance with the measuring principle of DSC-7.Using the kinetic parameters,the relationship among degree of curing,curing temporeture and curing time is predicted.This work may be used to proviole a throretical data for making curing technology parameters of SY-25 adhesive.
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Key words:
- curing ruction /
- kinetic parameter
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