Abstract: In order to arrive at a high interface bond strength of diamond-copper alloy composite materials,interface structure and properties between Ti-clad diamond and copper alloy are investigated by x-ray diffration analysis,SEM observation and griding test.Test results show that interface reaction between Ti clading and diamond occurs between 600-1200°.The epitaxial islands of TiC are formed acid grow on the diamond surface.The metallurgical bond of inter face between diamond and copper alloy is obtained. Bond strength between clad diamond and copper alloy remains at the level of 8×10⁷Pa.The grinding ratio of samples made from Ti-clad diamond is 30% higher than that without clad diamond.