Ti和Cu对C/Al复合材料界面反应的影响
EFFECT OF ADDITION OF Ti AND Cu ON THE INTERFACIAL REACTIONS IN C/AI COMPOSITE MATERIALS
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摘要: 在文献[1]所建立的C/Al复合材料界面反应动力学的基础上,利用扫描俄歇微探针深度分析测量了不同退火工艺的模拟C/Al-Ti和C/Al-Cu样品界面反应层的厚度,求得相应的界面反应激活能,并确定了界面反应从慢到快的顺序为C/Al-Ti、C/Al-Cu和C/Al。Abstract: Based on the kinetics of interfacial reaction in C/Al composite materials established in reference [1],the kinetics of interfacial reaction zone is measured by Scanning Auger Microprobe Depth Profile for simulated C/Al-Ti and C/Al-Cu specimens subjected to various annealing procedures.The activation energy of interfacial reaction is ordered increasingly as C/Al-Ti, C/Al-Cu and C/Al.
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Keywords:
- interfacial reaction /
- kinetics /
- activation energy /
- Scanning Auger Microprobe
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