高温超高压条件对Si中介结合的聚晶金刚石(PCD)组织与耐磨性的影响
THE INFLUENCE OF HIGH TEMPERATURE AND ULTRAHIGH PRESSURE ON STRUCTURE AND WEAR RESISTANCE OF SI BOND POLYCRYSTALLINE DIAMOND(PCD)
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摘要: 本文在一系列不同高温(1100~1650℃)超高压(4.5~6.25GFa)条件下制备了Si中介结合的聚晶金刚石,并用XRD分析,SEM观察及磨耗比测定对其组织与耐磨性进行了研究,结果表明:在PCD组织的P-T图上,有三类组织特征,其中对应最佳磨耗比的组织由金刚石和SiC组成.在较低压力、温度下有游离Si存在;高温低压条件下,金刚石发生石墨化转变,均使PCD的耐磨性降低.对获得金刚石和SiC相组织的压力、温度条件进行了分析讨论.Abstract: Abstract A series of PCD (polycrystalline diamond) samples with Si binder are produced at various high temperatures (1100℃一1650℃)and ultrahigh pressures (4.5-6.25GPa).Their structures and wear resistance are investigated by x-ray diffraction analysis, SEM observation and abrasion test.The resin is are shown that there are three zones on the P-T graph corresponding to various PCD structure.G-ratio of PCD which consists of diamond and SiC is optimum.Si is retained at lower pressure and lower temperature and diamond graphitization occurs st lower pressure and higher temperature.Thus,the wear resistance of these PCD is lower.The pressure and temperature conditions far PCD consisting of diamond and SiC are discussed.