SiCw/Al复合材料在TEM下的拉伸行为

THE TENSILE BEHAVIOR OF A SiCw/Al COMPOSITE UNDER TEM

  • 摘要: 在备有拉伸台的透射电镜上原位观察了SiCw/Al复合材料的变形、裂纹萌生及其扩展过程.结果发现,变形初期,位错主要从晶界及SiCw-Al界面处开动,在晶界与晶须周围产生大量位错.裂纹萌生源主要为:(1)材料制备过程中受损伤或破断的晶须;(2)晶须富集区.晶须与晶界对裂纹的扩展有阻碍作用.当裂纹取向与晶须大致垂直时,裂尖在晶须附近钝化然后绕过晶须扩展,当裂纹取向与晶须接近平行时,裂尖在晶须端部附近钝化后沿其一侧扩展.

     

    Abstract: The processes of the deformation,the crack initiation and growth in SiCw/Al composite have been observed by means of the in-situ transmission electron microscopy straining techniques.The results indicate that a great deal of dislocations would arise around grain boundaries and whiskers in the early deformation stages.Cracks are initiated mainly in whisker-riched regions and by the crack of the whiskers injured during the preparation for the composite.The whiskers and grain boundaries in the composite play an important role in impeding the crack growth.When the whisker in front of a crack tip is perpendicular to the crack,the crack tip would blunt near the whisker side and then advance along its nearinterface-region.Under the condition of the whisker in front of a crack tip parallel to the crack,the crack tip would blunt near the whisker end and then propagate along the nearinterface-region.

     

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