改性BMI树脂印刷电路板后处理工艺研究

STUDY OF POST TREATMENT FOR AN IMPROVED BMI MATRIX PRINTED CIRCUIT BOARD

摘要: 通过示差扫描量热法(DSC)和动态力学性能分析(DMA)等方法,对改性BMI树脂印刷电路板后处理工艺进行研究,根据DSC测试原理导出动力学方程,经计算机处理的结果表明,改性BMI树脂在200℃下后处理5小时得到固化程度达100%,而DMA试验显示树脂基体经200℃下后处理10小时才能充分固化。并且可以看出,低温条件下,固化效应与相应温度下损耗峰和固化网络部分链段运动有关。

Abstract: The post treatment for an improved BMI matrix printed circuit board was studied by using differential scanning calorimetry etc.Based on the principles of DSC,a kinetic equation was obtained and the results computed showed that 100% degree of cure might be achieved after the improved BMI resin was treated at 200℃ for 5 hrs.However,DMA temperature spectra revealed that curing could not be fully completed until the resin had been treated at 200℃ for 10 hrs.It was also found that a relationship existed between the curing degree,the height of the damping peak at low temperatures,and,thereby,the motion of the segments of the network molecules.