提高芳纶及其与X4502基体体系界面的耐湿热性研究

雷渭媛, 季铁正, 许亚洪, 田军安

雷渭媛, 季铁正, 许亚洪, 等. 提高芳纶及其与X4502基体体系界面的耐湿热性研究[J]. 复合材料学报, 1996, 13(3): 5-11.
引用本文: 雷渭媛, 季铁正, 许亚洪, 等. 提高芳纶及其与X4502基体体系界面的耐湿热性研究[J]. 复合材料学报, 1996, 13(3): 5-11.
Lei Weiyuan, Ji Tiezheng, Xu Yahong, et al. RESEARCH OF INCREASING MOISTURE-THERMO-RESISTANT PROPERTIES OF THE ARAMID FIBER AND THE INTERFACE OF THE ARAMID FIBER/X 4502 RESIN SYSTEM[J]. Acta Materiae Compositae Sinica, 1996, 13(3): 5-11.
Citation: Lei Weiyuan, Ji Tiezheng, Xu Yahong, et al. RESEARCH OF INCREASING MOISTURE-THERMO-RESISTANT PROPERTIES OF THE ARAMID FIBER AND THE INTERFACE OF THE ARAMID FIBER/X 4502 RESIN SYSTEM[J]. Acta Materiae Compositae Sinica, 1996, 13(3): 5-11.

提高芳纶及其与X4502基体体系界面的耐湿热性研究

基金项目: 航空科学基金;国家自然科学基金

RESEARCH OF INCREASING MOISTURE-THERMO-RESISTANT PROPERTIES OF THE ARAMID FIBER AND THE INTERFACE OF THE ARAMID FIBER/X 4502 RESIN SYSTEM

  • 摘要: 以多环氧基化合物(Ag-80)和烯丙基化合物(3-氯丙烯)分别处理芳纶(Kevlar49)表面,可显着提高芳纶及其与X4502基体体系界面粘结的耐湿热性。
    Abstract: Experimental results show that the surface chemical modification, with chemical reaction by the polyfunctional epoxide(Ag80) or 3-chloropropene into the skin layer of the aramid fiber(Kevlar 49) increases noticeably the moisture-thermo-esistant properties of the aramid fiber and of the interfacial adhesion between aramid fiber and X4502 resin.
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出版历程
  • 收稿日期:  1993-10-11
  • 修回日期:  1995-06-11
  • 刊出日期:  1996-08-31

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