STUDY OF LOW TEMPERATURE CURABLE BISMALEIMIDE RESINS Ⅱ. CHAIN EXTENDED BMI/DIALLYL BISPHENOL A SYSTEM
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摘要: 采用二元胺扩链改性,以提高前文[1]研究的低温固化共聚型BMI树脂的韧性.研究了扩链BMI树脂的配方、反应性、工艺性及其浇铸体和复合材料的性能.结果表明,改性BMI树脂的固化温度降到了150℃,韧性得到提高,复合材料性能优异.浇铸体弯曲强度119MPa,热变形温度272℃;玻璃纤维复合材料弯曲强度2034MPa,短梁剪切强度91.8MPa.Abstract: The cure temperature of bismaleimide (BMI) resins is known to be higher than 200℃, although their heat resistance and many other properties are excellent. The authors previous study[1] has shown that initiator is very effective in lowering the cure temperature of BMI resins, but its cured resin is brittle. This paper tried to use diamine extender and diallyl bisphenol A comonomer to increase to ughness of modified resin. An optimum resin form ulation cured at 150℃ was obtained using a computer-aided quadratic regression orthogonal combination design method. The resin casts have been detected to have the properties of middle toughness and excellent heat resistance, and composites to have good mechanical properties. This work has laid a good foundation for manufacturing composite tools and structures.
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Key words:
- bismal eimide /
- low temperature curable /
- extender /
- diallyl bisphenol A
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