酚酞聚芳醚酮双马来酰亚胺体系流变行为时间温度依赖性

胡晓兰, 余荣禄, 刘刚, 鲁腾飞, 益小苏

胡晓兰, 余荣禄, 刘刚, 等. 酚酞聚芳醚酮双马来酰亚胺体系流变行为时间温度依赖性[J]. 复合材料学报, 2012, (6): 37-41.
引用本文: 胡晓兰, 余荣禄, 刘刚, 等. 酚酞聚芳醚酮双马来酰亚胺体系流变行为时间温度依赖性[J]. 复合材料学报, 2012, (6): 37-41.
HU Xiaolan, YU Ronglu, LIU Gang, et al. Time and temperature dependence of rheological behavior for thermal PEKC BMI composite system[J]. Acta Materiae Compositae Sinica, 2012, (6): 37-41.
Citation: HU Xiaolan, YU Ronglu, LIU Gang, et al. Time and temperature dependence of rheological behavior for thermal PEKC BMI composite system[J]. Acta Materiae Compositae Sinica, 2012, (6): 37-41.

酚酞聚芳醚酮双马来酰亚胺体系流变行为时间温度依赖性

基金项目: 国家自然科学基金(51103121; 51203144); 航空科学基金(20125268002); 高等学校博士学科点专项科研基金(20090121120036); 留学回国人员科研启动基金; 厦门市科技计划(2010S0720); 福建省重大科技平台建设基金(2009J1009)
详细信息
    通讯作者:

    胡晓兰,博士,副教授,主要从事高分子基复合材料的研究E-mail:xlhu@xmu.edu.cn

  • 中图分类号: TB332

Time and temperature dependence of rheological behavior for thermal PEKC BMI composite system

  • 摘要: 采用流变仪对酚酞聚芳醚酮(PEKC)-双马来酰亚胺(BMI)树脂体系的流变特性的时间和温度依赖性进行了研究, 发现: BMI树脂凝胶点对频率有依赖性, 而tanδ对频率无依赖性; PEKC-BMI复合树脂体系的黏度增大主要是由于BMI对PEKC的溶解与BMI的热固化。相比较110℃和130℃两种条件, 在较高温度时复合树脂体系的黏度增大主要是热固化的影响; 随注胶温度提高, 复合体系的凝胶时间随PEKC含量的增加而快速缩短, 在较高注胶温度下凝胶模量增大较慢, 在较低注胶温度下凝胶时模量随PEKC含量的增加而提高较快; 随着复合树脂体系中PEKC含量的增加, 该体系的凝胶活化能由4.9 kJ/mol增大到65.9 kJ/mol, 表明该体系的凝胶化作用对温度的敏感性增大。
    Abstract: The rheological behaves of polyether-ether ketone (PEKC)-bismaleimide (BMI) system during isothermal curing was studied by in-situ rheology. The time and temperature dependence were discussed in detail. The influence of PEKC contents on the viscosity of the PEKC-BMI blends was investigated. The results show that the gel point of BMI resin is of the frequency dependence, while tanδ is frequency independent. The viscosity increase of PEKC-BMI resin system is caused by PEKC dissolving in BMI and BMI curing with the increasing temperature. Comparison of 110℃ with 130℃ shows that, at higher temperature, the viscosity increase of the composite resin system is mainly caused by BMI resin curing. As the temperature increase, the gel time with increasing PEKC content shortens more rapidly, while the gel modulus increment becomes less. However, at lower temperature, the gel modulus increment becomes more with increasing PEKC content. With PEKC content of the resin system increasing, the apparent activation energy of gelation reaction increases from 4.9 kJ/mol to 65.9 kJ/mol. It is indicated that the temperature sensitivity of gelation behavior increases.
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出版历程
  • 收稿日期:  2011-11-14
  • 修回日期:  2012-02-17
  • 刊出日期:  2012-12-14

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