Abstract: The kinetics of the cure reaction for a system of 840S epoxy resin was monitored by the differentail scanning calorimet ry (DSC) and investigated by the constant heating methods. According to the DSC graphs , the curingprocess temperatures such as gelation temperature ( T_gel ) , peak temperature ( T_p ) and t reat temperature ( T_treat ) wereacquired using T βgraph ext rapolation , and these temperatures play an important role in confirming the technicalparameters of the molding process of the resin system. The kinetic parameters of the curing reaction of 840S epoxyresin such as the overall activation energy E_a , the f requency factor A and the value of reaction order n wereobtained , and the kinetic model of the curing process based on n order reaction equation was set up using Kissingerand Crane equation. The characteristics of the curing reaction under dynamic and isothermal conditions is great useful for determining reasonable curing process parameters of the 840S epoxy resin system.