先驱体硅树脂高温连接C<sub>f</sub> / SiC 复合材料———惰性及活性填料对连接性能的影响

先驱体硅树脂高温连接C_f / SiC 复合材料———惰性及活性填料对连接性能的影响

摘要: 对先驱体硅树脂高温转化陶瓷接头连接C_f / SiC 复合材料进行了研究。探讨了硅树脂固化裂解过程、惰性及活性填料对连接性能的影响。研究表明, 硅树脂的交联固化主要通过消耗Si —OH 来完成。适当加入惰性填料SiC(5 % ,质量分数) 或活性填料(纳米Al 、Si 粉) 可以大幅度提高硅树脂对C_f / SiC 复合材料的连接性能。

Abstract: The joining of C_f / SiC composites with preceramic silicone resin (SR) at high temperature was studied.The influences of the curing and pyrolysis process of silicone resin and those of the inert and active fillers were especially discussed. The result s show that the curing process of SR was accomplished by Si —OH. An appropriateamount of inert filler SiC (5 % , mass f raction) or active filler nano-Al/ Si powder is good for the joining of C_f / SiCcomposites.