填充银纳米线各向同性导电胶的性能

吴海平; 吴希俊; 刘金芳; 王幼文; 张国庆

填充银纳米线各向同性导电胶的性能

1.
浙江大学材料与化学工程学院纳米科学和技术中心, 杭州 310027 ;
2.
浙江大学分析测试中心, 杭州 310027 ;

基金项目: 国家自然科学基金资助项目(59971045)

详细信息

通讯作者:
吴希俊, 教授, 博士生导师, 研究方向为纳米材料制备、先进电子封装材料　E-mail : Ludwig @zju. edu. cn

中图分类号: TB333
计量
- 文章访问数: 2738
- PDF下载量: 1656
- 被引次数: 0
出版历程
- 收稿日期: 2005-10-19
- 修回日期: 2006-01-09
- 刊出日期: 2006-10-15

Isotropical conductive adhesives filled with silver nanowires

1.
Center of NanO₂Science and Nano-Technology| College of Materials andChemical Engineering| Zhejiang University| Hangzhou 310027| China ;
2.
Center of Analyzing and Testing| Zhejiang University| Hangzhou 310027| China ;
3.
Center for Analysis| Zhejiang Sci2Tech University| Hangzhou 310018| China

摘要

摘要: 以Ti (OC₄H₉)₄ 水解形成的溶胶体系为模板, 以AgNO₃ 为银纳米线的前驱体, 低温下合成长径比为50～60 的银纳米线, 采用TEM 和XRD 对所制得的银纳米线进行表征。以银纳米线作为导电胶的导电填料, 成功制备了一种高电导率的各向同性导电胶。导电胶的电学性能和力学性能测试表明: 这种导电胶在导电填料含量为56 wt %时的电导率比填充75 wt %微米银粒子的导电胶高约6 倍(体积电阻率为1. 2 ×10^-4Ω·cm) 。由于填料含量的降低, 该导电胶的抗剪切强度(以Al 为基板时的抗剪切强度为17. 6 MPa) 相比于填充75 wt %微米银粒子和75 wt %纳米银粒子导电胶均有不同程度的提高。
- 各向同性 /
- 导电胶 /
- 纳米线 /
- 银粒子
Abstract: With the nanoporous templates formed by the cont rolled hydrolysis and condensation of butyl titanate( Ti (OC₄H₉)₄ ) , silver (Ag) nanowires with a slenderness ratio of 50～60 were prepared by using silver nit rate (AgNO₃ ) as precursor. The prepared Ag nanowires were characterized by X-ray diff raction (XRD) and t ransmissionelect ro microscopy ( TEM) . A new kind of isot ropical conductive adhesive ( ICA) was developed by using these Agnanowires as conductive filler. The bulk resistivity and shear st rength testing results show that the novel ICA filledwith Ag nanowires (mass f raction 56 %) has bulk resistivity (1. 2 ×10^-4Ω·cm) 6 times lower than that of ICA filledwith Ag particles (mass f raction 75 %) . For the lower filler content , the ICA filled with Ag nanowires exhibit shigher shear st rength (17. 6 MPa on Al subst rate) than the ICA filled with micrometer-sized Ag particles or nanometer-sized Ag particles cloes.
- isot ropical /
- conductive adhesives /
- nanowires /
- silver particles