水热法合成硅灰石基抗静电填料及其在水性环氧树脂中的应用

Hydrothermal synthesis of wollastonite based antistatic filler and its application in water-based epoxy resin

  • 摘要: 为解决静电引发的火灾爆炸问题,采用水热合成法制备SnO2@硅灰石(SW)抗静电复合粉体。研究了包覆量、pH值、四氯化锡浓度等对复合粉体体积电阻率的影响,并通过SEM、TEM、XRD表征其结构。通过十二烷基三乙氧基硅烷改性复合粉体,结合红外光谱探讨硅烷与复合粉体的作用机制。结果表明,当包覆量为26%、pH值为11、四氯化锡浓度为1 mol/L、反应时间6 h、温度180℃时,复合粉体体积电阻率最低,为5.38×105 Ω·cm,纳米氧化锡均匀负载在硅灰石表面,粒径为21.22 nm。硅烷与复合粉体表面的Sn-OH反应,形成Si-O-Sn键,复合粉体由亲水性转为疏水性,活化指数为99.9%。将改性复合粉体(MSWP)填入水性环氧树脂(WBER)中,制备了耐酸、碱、水的抗静电涂料。研究表明,MSWP填充量2%、固化时间2 h、固化剂用量30%、水与环氧乳液比例1∶1时,涂料电阻率最低,为1.70×105 Ω·cm,抗静电机制为填料颗粒通过接触或通过跳跃、弹道传输、隧道或扩散运动进而形成导电链。

     

    Abstract: To address the issue of fire and explosion caused by static electricity, SnO2@wollastonite (SW) antistatic composite powder was prepared by hydrothermal synthesis method. The effects of coating amount, pH value, tin tetrachloride concentration, and other factors on the resistivity of the composite powder were studied, and its structure was characterized using SEM, TEM and XRD. The composite powder was further modified with dodecyl triethoxysilane, and the interaction mechanism between the silane and the composite powder was explored using infrared spectroscopy. The results show that when the coating amount is 26%, the pH value is 11, the tin tetrachloride concentration is 1 mol/L, the reaction time is 6 h, and the temperature is 180°C, the composite powder exhibits the lowest volume resistivity of 5.38×105 Ω·cm, with uniform loading of nano-tin oxide on the surface of wollastonite and a particle size of 21.22 nm. The silane reacts with Sn-OH on the surface of the composite powder, forming Si-O-Sn bonds, which changes the composite powder from hydrophilic to hydrophobic, with an activation index of 99.9%. The modified composite powder (MSWP) was then incorporated into water-based epoxy resin (WBER) to prepare an antistatic coating with resistance to acid, alkali, and water. The study shows that when the MSWP content is 2%, curing time is 2 h, curing agent amount is 30%, and the water-to-epoxy emulsion ratio is 1∶1, the coating had the lowest resistivity of 1.70×105 Ω·cm. The antistatic mechanism of the coating is that filler particles formed conductive chains through contact or via hopping, ballistic transport, tunneling, or diffusion processes.

     

/

返回文章
返回