高热导率无机填料/硅橡胶复合绝缘材料的电性能

Electrical properties of high thermal conductivity inorganic fillers/silicone rubber composites

  • 摘要: 分别添加不同含量的微米Al2O3(0.5~3 μm)、微米Si3N4(0.3~3 μm)和纳米Al2O3(13 nm), 利用共混法制备了具有不同导热性能的无机填料/硅橡胶复合材料。填料体积分数为30%时, 通过改变微米Si3N4和纳米Al2O3体积比, 发现微米Si3N4和纳米Al2O3共填充的硅橡胶复合材料的热导率较微米Si3N4/硅橡胶复合材料的 热导率有显著提高, 其中当微米Si3N4与纳米Al2O3体积比为26∶4时, 硅橡胶复合材料的热导率(1.64 W/(m·K)) 约为单一微米Si3N4填充的硅橡胶复合材料热导率(0.52 W/(m·K))的3倍。同时, 微米Si3N4和纳米Al2O3共填充的硅橡胶复合材料有较高的击穿场强和优异的绝缘特性。

     

    Abstract: Filled with micro-Al2O3(0.5~3 μm), micro-Si3N4(0.3~3 μm) and nano-Al2O3 , different thermal conductive silicone rubber composites were prepared by the blending method. Micro-Si3N4 and nano-Al2O3 according to different volume ratio were compounded with silicone rubber and the total volume fraction was fixed at 30%. It is found that with the same volume fraction, the thermal conductivity of all the micro-Si3N4 and nano-Al2O3 co-filled composites have remarkable improvement compared with that of the composite filled with micro-Si3N4. Especially, when the volume ratio of micro-Si3N4 to nano-Al2O3 is 26∶4, the thermal conductivity (1.64 W/(m·K)) is three times as high as that of the composite filled with micro-Si3N4 (0.52 W/(m·K)). At the same time, the micro-Si3N4 and nano-Al2O3 co- filled silicone rubber composites remain the good voltage breakdown strength and excellent insulating properties.

     

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