Cu、Ni掺杂硅基负极材料的双重碳层包覆:抑制体积膨胀与提升导电性能

Dual carbon layer coating of Cu and Ni doped silicon-based anode materials: Inhibiting volume expansion and enhancing conductivity

  • 摘要: 硅因其高理论比容量(4200 mA·h·g−1)被视为是继石墨之后最具发展前景的负极材料。但嵌脱锂过程中巨大的体积效应使得硅容易发生粉化,极大地影响了其循环稳定性。本研究通过静电纺丝及微电子3D打印技术相结合的方法,通过分别掺杂金属Cu与金属Ni制备了具有抑制体积膨胀,高导电性的多孔碳骨架硅基负极结构。结果表明:在电流密度为0.1 A·g−1的条件下,Si/Ni@C与Si/Cu@C电极的首次放电比容量分别为1591 mA·h·g−1与1603 mA·h·g−1,首周库伦效率均为73%。Si/Ni@C电极在100次循环后由1197 mA·h·g−1衰减至1143 mA·h·g−1,容量保持率为95%;Si/Cu@C电极在100次循环后由1179 mA·h·g−1衰减至1075 mA·h·g−1,容量保持率为91%。相比而言,金属掺杂后的多孔电极有更优的循环稳定性和导电性。

     

    Abstract: Silicon is regarded as the most promising anode material after graphite due to its high theoretical specific capacity (4200 mA·h·g−1). However, the huge volume effect during the lithium insertion and extraction process causes silicon to be easily pulverized, which greatly affects its cycle stability. In this study, porous carbon skeleton silicon-based anode structures with volume expansion inhibition and high conductivity were prepared by doping metals Cu and Ni respectively through a combination of electrospinning and microelectronic 3D printing technologies. The results show that at a current density of 0.1 A·g−1, the initial discharge specific capacities of the Si/Ni@C and Si/Cu@C electrodes are 1591 mA·h·g−1 and 1603 mA·h·g−1, respectively, with the first-cycle Coulombic efficiency both being 73%. After 100 cycles, the capacity of the Si/Ni@C electrode decreases from 1197 mA·h·g−1 to 1143 mA·h·g−1, with a capacity retention rate of 95%; The capacity of the Si/Cu@C electrode decreases from 1179 mA·h·g−1 to 1075 mA·h·g−1, with a capacity retention rate of 91%. In comparison, the metal-doped porous electrodes exhibit better cycle stability and conductivity.

     

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