Abstract: Thermal conductive composites have a wide range of applications in the fields of electronic packaging, motor materials, batteries and heat exchange equipment. Polyvinylidene fluoride (PVDF) has excellent electrical properties, good mechanical strength and high temperature resistance. It is one of the ideal materials for applications in electronics, aerospace and other industries. However, the low thermal conductivity restricts its further development. It is urgent to develop PVDF-based high thermal conductivity composites. The key to its preparation is how to select high thermal conductivity fillers, design thermal conduction pathways, and regulate interface thermal resistance. Based on the theoretical knowledge of the mechanism, model, equation and numerical simulation of polymer-based thermal conductive composites, combined with the crystal structure of PVDF, this paper introduces the current development level of thermal conductivity of PVDF-based thermal conductive composites, and the different effects of various fillers and preparation processes on their thermal conductivity. The latest research progress of high thermal conductivity PVDF composites is reviewed from the perspectives of composite strategy, network structure and interface bonding. In addition, its future development is also prospected.