Abstract: Ti/Mg bimetallic composite possesses the virtues of both elements and is endowed with significant potential for multiple applications in fields such as aerospace, transportation, and others. Recently, it has been widely concerned by global scholars and researchers. Employing an interlayer metal as a typical means of interfacial strengthening to realize the metallurgical bonding of Ti and Mg alloys for a substantial discrepancy in melting points, weak metallurgical reaction, and low mutual solid solubility between Mg and Ti. The control and optimization of interfacial reaction are crucial in enhancing interfacial bonding strength, but also the difficulty of interfacial strengthening. Overview of research progress of Ti/Mg bimetallic composites fabricated by different join methods and analyzing the effect of interfacial microstructure on interfacial bonding strength was analyzed. The interfacial bonding strength with different interfacial strengthening methods under various join technology was listed. The Ti/Mg bimetallic interface bonding mechanism was summarized and the future research of Ti/Mg bimetallic interfacial strengthening has been prospected.